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Dry film tenting problem & pattern plating

Dry film tenting problem & pattern plating

2010-01-06 by Volkan

Hi,
I'm facing  dry film tenting problems. It couldn't protect THP holes and tents start to break during developing. I did some googling and saw that this problem is known and according to Dupont technical articles, it is recommended to increase exposure duration to avoid tent break. I tried it and I saw great improvement.
Another  recommendation was, to reduce roller pressure to avoid hole sharp edge cutting of the film. It  is stated that pressure in the holes decreases after lamination and it sucks film (film is liquid during lamination) to the holes and because of that, sharp hole edges cut the film. This cut decreases film strength. Another advise was to decrease the lamination temperature.  I also tested both, they helped but didn't solve the problem completely. 

My second try was to use pattern plating method. I tried electroplated tin as a resist and  ammonium persulfate as an etcher, it didn't act as an etch resist and etched away with copper. 

Any ideas/suggestions or does anyone faced similar tenting problems?
Which etcher can be used for tin or nickel etch resist? Is there any practical formula for homebrewers?
I'll appreciate a lot on any guidance.
Thanks,

Volkan

Re: [Homebrew_PCBs] Dry film tenting problem & pattern plating

2010-01-06 by Stefan Trethan

Hi,

I think only the sulphuric acid / hydrogen peroxide etchant will work
with tin as reisist.
It is similar to CuCl but has the disadvantage of not keeping as well,
requiring more maintainance.

I think gold would work as a resist for the other etchants, but is
slightly more expensive ;-)

ST
Show quoted textHide quoted text
On Wed, Jan 6, 2010 at 9:04 AM, Volkan <v_sahin@...> wrote:
> Hi,
> I'm facing  dry film tenting problems. It couldn't protect THP holes and tents start to break during developing. I did some googling and saw that this problem is known and according to Dupont technical articles, it is recommended to increase exposure duration to avoid tent break. I tried it and I saw great improvement.
> Another  recommendation was, to reduce roller pressure to avoid hole sharp edge cutting of the film. It  is stated that pressure in the holes decreases after lamination and it sucks film (film is liquid during lamination) to the holes and because of that, sharp hole edges cut the film. This cut decreases film strength. Another advise was to decrease the lamination temperature.  I also tested both, they helped but didn't solve the problem completely.
>
> My second try was to use pattern plating method. I tried electroplated tin as a resist and  ammonium persulfate as an etcher, it didn't act as an etch resist and etched away with copper.
>
> Any ideas/suggestions or does anyone faced similar tenting problems?
> Which etcher can be used for tin or nickel etch resist? Is there any practical formula for homebrewers?
> I'll appreciate a lot on any guidance.
> Thanks,
>
> Volkan
>

Re: [Homebrew_PCBs] Dry film tenting problem & pattern plating

2010-01-06 by Larry Battraw

On Wed, Jan 6, 2010 at 4:09 AM, Stefan Trethan <stefan_trethan@...> wrote:
>
>
>
> Hi,
>
> I think only the sulphuric acid / hydrogen peroxide etchant will work
> with tin as reisist.
> It is similar to CuCl but has the disadvantage of not keeping as well,
> requiring more maintainance.
>
> I think gold would work as a resist for the other etchants, but is
> slightly more expensive ;-)
>
> ST

Hi Stefan, I've been working CuCl etchant recently and really had
problems with the terrible fumes it puts off, particularly when it's
heated so it will actually etch a board.  Can you explain a little
about the disadvantages of Sulfuric/Peroxide etchant and how to
maintain the etchant bath?  Sulfuric acid seems so much less harsh
when it comes to fumes and I would like to try it.  Do have any
suggestions for the concentrations or PH of the solution to make it
work?

Thanks-
Larry

Re: [Homebrew_PCBs] Dry film tenting problem & pattern plating

2010-01-06 by Leon Heller

----- Original Message ----- 
Show quoted textHide quoted text
From: "Volkan" <v_sahin@...>
To: <Homebrew_PCBs@yahoogroups.com>
Sent: Wednesday, January 06, 2010 8:04 AM
Subject: [Homebrew_PCBs] Dry film tenting problem & pattern plating


> Hi,
> I'm facing  dry film tenting problems. It couldn't protect THP holes and 
> tents start to break during developing. I did some googling and saw that 
> this problem is known and according to Dupont technical articles, it is 
> recommended to increase exposure duration to avoid tent break. I tried it 
> and I saw great improvement.
> Another  recommendation was, to reduce roller pressure to avoid hole sharp 
> edge cutting of the film. It  is stated that pressure in the holes 
> decreases after lamination and it sucks film (film is liquid during 
> lamination) to the holes and because of that, sharp hole edges cut the 
> film. This cut decreases film strength. Another advise was to decrease the 
> lamination temperature.  I also tested both, they helped but didn't solve 
> the problem completely.
>
> My second try was to use pattern plating method. I tried electroplated tin 
> as a resist and  ammonium persulfate as an etcher, it didn't act as an 
> etch resist and etched away with copper.
>
> Any ideas/suggestions or does anyone faced similar tenting problems?
> Which etcher can be used for tin or nickel etch resist? Is there any 
> practical formula for homebrewers?
> I'll appreciate a lot on any guidance.
> Thanks,

There aren't many of us homebrew PCB makers here. Try the Homebrew PCB Yahoo 
group. Someone there has probably done something similar.

Leon

Re: [Homebrew_PCBs] Dry film tenting problem & pattern plating

2010-01-06 by Leon Heller

----- Original Message ----- 
Show quoted textHide quoted text
From: "Leon Heller" <leon355@...>
To: <Homebrew_PCBs@yahoogroups.com>
Sent: Wednesday, January 06, 2010 2:35 PM
Subject: Re: [Homebrew_PCBs] Dry film tenting problem & pattern plating


> ----- Original Message ----- 
> From: "Volkan" <v_sahin@...>
> To: <Homebrew_PCBs@yahoogroups.com>
> Sent: Wednesday, January 06, 2010 8:04 AM
> Subject: [Homebrew_PCBs] Dry film tenting problem & pattern plating
>
>
>> Hi,
>> I'm facing  dry film tenting problems. It couldn't protect THP holes and
>> tents start to break during developing. I did some googling and saw that
>> this problem is known and according to Dupont technical articles, it is
>> recommended to increase exposure duration to avoid tent break. I tried it
>> and I saw great improvement.
>> Another  recommendation was, to reduce roller pressure to avoid hole 
>> sharp
>> edge cutting of the film. It  is stated that pressure in the holes
>> decreases after lamination and it sucks film (film is liquid during
>> lamination) to the holes and because of that, sharp hole edges cut the
>> film. This cut decreases film strength. Another advise was to decrease 
>> the
>> lamination temperature.  I also tested both, they helped but didn't solve
>> the problem completely.
>>
>> My second try was to use pattern plating method. I tried electroplated 
>> tin
>> as a resist and  ammonium persulfate as an etcher, it didn't act as an
>> etch resist and etched away with copper.
>>
>> Any ideas/suggestions or does anyone faced similar tenting problems?
>> Which etcher can be used for tin or nickel etch resist? Is there any
>> practical formula for homebrewers?
>> I'll appreciate a lot on any guidance.
>> Thanks,
>
> There aren't many of us homebrew PCB makers here. Try the Homebrew PCB 
> Yahoo
> group. Someone there has probably done something similar.

Sorry about that, I thought I was on the Pulsonix forum for some reason. 
It's probably senile dementia setting in.

Leon

Re: [Homebrew_PCBs] Dry film tenting problem & pattern plating

2010-01-06 by Stefan Trethan

I can't remember anything of use about the sulphuric acid thing.
What I do remember is that copper sulphate crystallizes out when the
etchant is cooled, which is neat, but for some reason I decided it is
not for me. I think it had to do with H2O2 stability but I'm not sure.

The discussion about it was here on this list, but years ago.

Regarding CuCl, if it has terrible fumes you do something wrong.

Most likely The Heating. Don't you ever heat CuCl unless to warm it up
from storage in a very cold room. HCl has a really low boiling point
(like 50C or something) and will fume like crazy even below that. Room
temperature is fine, it will take a few minutes but that should be OK.

A possible reason for fumes can also be too high HCl molarity, H2O2
should not be a problem unless you use a crazy amount.

I keep my CuCl in a covered, but not airtight tank, right next to a
lot of tools and steel items. There is no corrosion and no noticeable
odor. Even when etching with the air pump running there's no issue.

You should figure out what is wrong with your CuCl, I really doubt
sulphuric etchant is the answer. Do you know this already?
<http://members.optusnet.com.au/eseychell/PCB/etching_CuCl/index.html>

ST
Show quoted textHide quoted text
On Wed, Jan 6, 2010 at 1:50 PM, Larry Battraw <lbattraw@...> wrote:

>
> Hi Stefan, I've been working CuCl etchant recently and really had
> problems with the terrible fumes it puts off, particularly when it's
> heated so it will actually etch a board.  Can you explain a little
> about the disadvantages of Sulfuric/Peroxide etchant and how to
> maintain the etchant bath?  Sulfuric acid seems so much less harsh
> when it comes to fumes and I would like to try it.  Do have any
> suggestions for the concentrations or PH of the solution to make it
> work?
>
> Thanks-
> Larry
>
>

Re: [Homebrew_PCBs] Dry film tenting problem & pattern plating

2010-01-07 by Simao Cardoso

Volkan wrote: 
> 
> Which etcher can be used for tin or nickel etch resist? Is there any
> practical formula for homebrewers?

Maybe its better to use dip coating of LPI resists filling the holes.
You referred an homebrew resist off PVA and dichromate, other is acrylic
resin and benzophenone (same thing used in dry films) an US based ebay
seller had 50 Lb of this chemical to sell recently. 
If you are using real tin electroplating, you may look to Adam Seychell
work with Ammonium Chloride etchant.
Not ammonium based, the only things i know off as tin resist compatible
etchants are us patents  4144119/4378270  and 4632727.

Re: [Homebrew_PCBs] Dry film tenting problem & pattern plating

2010-01-07 by Simao Cardoso

Volkan Sahin wrote:

> 
> I'm facing dry film tenting problems.  

Increase pad anular ring. Ugly but works.

> tin or nickel etch resist? 

Dont go with nickel. It seems cheap and will be great to immersion gold
finish but it don't resist in CuCl and since you have to use a complex
etchant you should avoid the boric acid in the nickel plating setup.

Re: [Homebrew_PCBs] Dry film tenting problem & pattern plating

2010-01-08 by Volkan Sahin

Hi Simao,Stephan,
Thanks for your help. 
I no longer use dichromated resist  because of environmental issues. I tried to get liquid resist from the e-bay seller but couldn't get it. They said there will be a week delay and silence. It is like a ghost company. I canceled my order and got dry film from think&tinker. 
It seems peroxy-sulfuric  etcher won't etch tin etch resist and it is possible to obtain  stabilizer  from think&tinker in low volume.
Volkan

--- On Wed, 1/6/10, Simao Cardoso <simaocardoso@gmail.com> wrote:
Show quoted textHide quoted text
From: Simao Cardoso <simaocardoso@...>
Subject: Re: [Homebrew_PCBs] Dry film tenting problem & pattern plating
To: Homebrew_PCBs@yahoogroups.com
Date: Wednesday, January 6, 2010, 7:37 PM







 



  


    
      
      
      Volkan wrote: 

> 

> Which etcher can be used for tin or nickel etch resist? Is there any

> practical formula for homebrewers?



Maybe its better to use dip coating of LPI resists filling the holes.

You referred an homebrew resist off PVA and dichromate, other is acrylic

resin and benzophenone (same thing used in dry films) an US based ebay

seller had 50 Lb of this chemical to sell recently. 

If you are using real tin electroplating, you may look to Adam Seychell

work with Ammonium Chloride etchant.

Not ammonium based, the only things i know off as tin resist compatible

etchants are us patents  4144119/4378270  and 4632727. 





    
     

    
    


 



  






      

[Non-text portions of this message have been removed]

Re: [Homebrew_PCBs] Dry film tenting problem & pattern plating

2010-01-08 by Volkan Sahin

Hi Stefan,
Sorry for the typo, I couldn't write your name correctly.


--- On Thu, 1/7/10, Volkan Sahin <v_sahin@...> wrote:
Show quoted textHide quoted text
From: Volkan Sahin <v_sahin@...>
Subject: Re: [Homebrew_PCBs] Dry film tenting problem & pattern plating
To: Homebrew_PCBs@yahoogroups.com
Date: Thursday, January 7, 2010, 9:21 PM







 



  


    
      
      
      Hi Simao,Stephan,

Thanks for your help. 

I no longer use dichromated resist  because of environmental issues.. I tried to get liquid resist from the e-bay seller but couldn't get it. They said there will be a week delay and silence. It is like a ghost company.. I canceled my order and got dry film from think&tinker. 

It seems peroxy-sulfuric  etcher won't etch tin etch resist and it is possible to obtain  stabilizer  from think&tinker in low volume.

Volkan



--- On Wed, 1/6/10, Simao Cardoso <simaocardoso@ gmail.com> wrote:



From: Simao Cardoso <simaocardoso@ gmail.com>

Subject: Re: [Homebrew_PCBs] Dry film tenting problem & pattern plating

To: Homebrew_PCBs@ yahoogroups. com

Date: Wednesday, January 6, 2010, 7:37 PM



 



Volkan wrote: 



> 



> Which etcher can be used for tin or nickel etch resist? Is there any



> practical formula for homebrewers?



Maybe its better to use dip coating of LPI resists filling the holes.



You referred an homebrew resist off PVA and dichromate, other is acrylic



resin and benzophenone (same thing used in dry films) an US based ebay



seller had 50 Lb of this chemical to sell recently. 



If you are using real tin electroplating, you may look to Adam Seychell



work with Ammonium Chloride etchant.



Not ammonium based, the only things i know off as tin resist compatible



etchants are us patents  4144119/4378270  and 4632727. 



[Non-text portions of this message have been removed]





    
     

    
    


 



  






      

[Non-text portions of this message have been removed]

Re: [Homebrew_PCBs] Dry film tenting problem & pattern plating

2010-01-08 by Simao Cardoso

Volkan Sahin wrote:

> 
> It seems peroxy-sulfuric etcher won't etch tin etch resist and it is
> possible to obtain  stabilizer  from think&tinker in low volume.



I don't know why Stefan Trethan says that, i also said lots of very
wrong things in here already, but is really bad when we induce people in
mistake. 

The peroxy-sulfuric will etch tin without additives. The stabilizer is
for the 35% - 50% hydrogen peroxide don't decompose in explosion when
you put a copper board in there.

I also wish to use a sulfuric based etchant but not like this. 
Did you read the patents i mentioned?

Re: [Homebrew_PCBs] Dry film tenting problem & pattern plating

2010-01-08 by Stefan Trethan

I didn't understand what you are saying there. Anyway I made it plenty
clear that my information about this etchant is very thin indeed.

ST
Show quoted textHide quoted text
On Fri, Jan 8, 2010 at 1:47 PM, Simao Cardoso <simaocardoso@...> wrote:
> Volkan Sahin wrote:
>
>>
>> It seems peroxy-sulfuric etcher won't etch tin etch resist and it is
>> possible to obtain  stabilizer  from think&tinker in low volume.
>
>
>
> I don't know why Stefan Trethan says that, i also said lots of very
> wrong things in here already, but is really bad when we induce people in
> mistake.
>
> The peroxy-sulfuric will etch tin without additives. The stabilizer is
> for the 35% - 50% hydrogen peroxide don't decompose in explosion when
> you put a copper board in there.
>
> I also wish to use a sulfuric based etchant but not like this.
> Did you read the patents i mentioned?
>
>
>

Re: [Homebrew_PCBs] Dry film tenting problem & pattern plating

2010-01-08 by Simao Cardoso

Stefan Trethan wrote:
>   
> I didn't understand what you are saying there. Anyway I made it plenty
> clear that my information about this etchant is very thin indeed.

Ohh sorry it's obviously nothing personal, but you mentioned at least 2
times recently that sulfuric etchants won't etch tin. I don't know much
about this, but i also never saw any prove to that.

Re: [Homebrew_PCBs] Dry film tenting problem & pattern plating

2010-01-08 by Stefan Trethan

Seems you are right one would need to use tin/lead. Some sources say
sulphuric acid / peroxide attacks tin.

Well, one would have to dig out the discussion from a few years ago to
see the details.

ST
Show quoted textHide quoted text
On Fri, Jan 8, 2010 at 2:03 PM, Simao Cardoso <simaocardoso@...> wrote:
> Stefan Trethan wrote:
>>
>> I didn't understand what you are saying there. Anyway I made it plenty
>> clear that my information about this etchant is very thin indeed.
>
> Ohh sorry it's obviously nothing personal, but you mentioned at least 2
> times recently that sulfuric etchants won't etch tin. I don't know much
> about this, but i also never saw any prove to that.
>
>

Re: [Homebrew_PCBs] Dry film tenting problem & pattern plating

2010-01-08 by Simao Cardoso

Stefan Trethan wrote:

> 
> Well, one would have to dig out the discussion from a few years ago to
> see the details.

I should do it too, but in another moment off non confirmed comments; if
i read it right or if is still used the stabilizer for peroxide
decomposition are phenol compounds. If Phenolsulfonic acid is used
should stabilize peroxide and protect tin. If so makes the think&tinker
stabilizer useful in both ways. Since non ammonia etchants compatible
with tin resist use phosphoric acid and derivatives to protect tin. (no
experience just read it).
I think that in 'printed circuits handbook' is written that adding
phosphoric acid to ammonia persulfate makes it tin compatible i will try
to check that too. 

The last off the patents i mentioned shows nitric as oxidizer in small
amount on a mixture of sulphuric and phosphoric acid (among other
stuff), making a tin compatible etchant. Since is easier to get nitric
acid than high concentration peroxide it may be a nice candidate. But
although i have it all in my house i never try it...

Re: [Homebrew_PCBs] Dry film tenting problem & pattern plating

2010-01-09 by Simao Cardoso

Simao Cardoso wrote:
> I think that in 'printed circuits handbook' is written that adding
> phosphoric acid to ammonia persulfate makes it tin compatible i will
> try to check that too. 

refered on this page
http://books.google.pt/books?id=1Pbkeu6dZ_sC&pg=SA34-PA3
more on this page
http://books.google.pt/books?id=1Pbkeu6dZ_sC&pg=SA34-PA16
the page before is also on-topic

Google is easier than the heavy book :>

To Volkan Sahin:

Trying to find a recipe got me to really old patents like 3476624 (1969)
where 2.25% phosphoric acid is added to a 25% solution of ammonium
persulfate, among a prohibited hazard etch accelerator. And later claim
that 0.5% to 15% phosphoric acid leaves the solder usable. You must know
this will leave the plated pure tin black.

While googling more 3 old patents came out 4419183 4636282 4130454, all
using Sulfuric acid, Hydrogen Peroxide (35%), Phenolsulfonic acid, not
tin compatible but tin compatible patents differ in the 5% phosphoric
acid and some not important things to a chemistry ignorant like me.

If you wish to try any off this, phosphoric acid can be bought as rust
remover, in almost anyplace where inks are sold. The one i got only says
about content 'contains solution of phosphoric acid', it's like a
yellowish gel that dries in to a white paste.
The 1L bottle of 85% phosphoric acid i got from the drug store it's less
yellowish, almost as low viscous as water. So the rust remover must have
a thicker but guessing that is something non hazard, cheap additive,
maybe it's PVP and maybe won't interfere in the etch.

But if you accept any advise from me. If you are doing this to test your
incredible good and fast UV laser raster flatbed printer. Using it with
laminated dry film, pattern plating, metallic resist plating and
metallic resist compatible etchant, won't make your machine so
incredible if you have to go trough all this. It's required if inkjet
used, but with laser direct print you should use LPI resist and CuCl
etchant and enjoy some free time and effort. And a repeatable process
for soldermak.

Can you get acrylic resin? Isn't expensive, mine was 5eur a 1L bottle. I
bought it on one supermarket (as we call those stores here) where i also
buy food, household things and so. Don't know what for people buy this
but bottle says 'used to make inks and to brighten hood floor'. The
benzophenone, ebay last item, was 260452044449, contact seller it may
still have it. He/she is listing the 50 packages off it from July at
least and only sold a few. I would bought it and oversea price given was
good, but unfortunately i asked customs if they will consider it as drug
or ask laboratory test and it went from office to office up to the
government secretary responsibly and no one know to answer. Local
chemical suppliers all ignore me. But this should be a good homebrew ink
to use in the epson print head, i passed acrylic resin with a syringe in
a hp head using those special clips and it passes like water. 
I don't have a recipe from a book to make the resist but should be 5%
photoinitiator like in pva dichromated. 

Recently when searching for a copper plating additives supplier i was
impressed by Atotech. (They are also in US) And don't only have the
chemicals to plating and finishings but also LPI resists soldermask and
one part legend.  (Among things that make phophorizated copper anodes
and anode bags in PTH useless) With my luck with chemical suppliers i
didn't yet stop on the near by store but i hope they be better. 

Good luck!

Re: [Homebrew_PCBs] Dry film tenting problem & pattern plating

2010-01-09 by Simao Cardoso

Simao Cardoso wrote:

> refered on this page
> http://books.google.pt/books?id=1Pbkeu6dZ_sC&pg=SA34-PA3
> more on this page
> http://books.google.pt/books?id=1Pbkeu6dZ_sC&pg=SA34-PA16
> the page before is also on-topic
> 
> Google is easier than the heavy book :>

Sorry the localized url. It's what google gives me according to my
localization/IP. I think it shows it in English to most off you. 

Correcting:
http://books.google.com/books?id=1Pbkeu6dZ_sC&pg=SA34-PA3 
http://books.google.com/books?id=1Pbkeu6dZ_sC&pg=SA34-PA16

Re: [Homebrew_PCBs] Dry film tenting problem & pattern plating

2010-01-11 by Adam Seychell

Volkan wrote:
>  
> 
> Hi,
> I'm facing dry film tenting problems. It couldn't protect THP holes and 
> tents start to break during developing. I did some googling and saw that 
> this problem is known and according to Dupont technical articles, it is 
> recommended to increase exposure duration to avoid tent break. I tried 
> it and I saw great improvement.
> Another recommendation was, to reduce roller pressure to avoid hole 
> sharp edge cutting of the film. It is stated that pressure in the holes 
> decreases after lamination and it sucks film (film is liquid during 
> lamination) to the holes and because of that, sharp hole edges cut the 
> film. This cut decreases film strength. Another advise was to decrease 
> the lamination temperature. I also tested both, they helped but didn't 
> solve the problem completely.
> 
> My second try was to use pattern plating method. I tried electroplated 
> tin as a resist and ammonium persulfate as an etcher, it didn't act as 
> an etch resist and etched away with copper.
> 
> Any ideas/suggestions or does anyone faced similar tenting problems?
> Which etcher can be used for tin or nickel etch resist? Is there any 
> practical formula for homebrewers?
> I'll appreciate a lot on any guidance.
> Thanks,
> 

I've been using tenting method with great success and is one of the few 
operations that have not cause me headaches. My first comment is that 
you have resist adhesion problems. In my experience, dry film tenting 
over holes holds up very well, even for holes large as 3mm. I use a wet 
lamination method so the holes are actually filled with water.  I have 
not tried hot roll lamination.

Forget about pattern plating. I have been down that path and its 
disadvantages outweigh advantages. A tin resist requires difficult to 
maintain alkaline etchants. Also, tin plating solutions become depleted 
by atmospheric oxidation when they are used infrequently. A Sn/Pb 
plating bath may allow use of persulfate or peroxy sulfuric etchants but 
again I believe you'll also have tin(II) oxidation problems.

Overexposed dry film will become brittle , and could be a source of your 
problem. Are the traces are holding up ok, and you find cracks in the 
dry film covering the hole opening ?
Is the resist lifting around the outside of the pad ?

Adam

Re: [Homebrew_PCBs] Dry film tenting problem & pattern plating

2010-01-11 by Volkan Sahin

Hi Adam,
Thanks for the reply.
>I've been using tenting method with great success and is one of the few 

>operations that have not cause me headaches. My first comment is that 

>you have resist adhesion problems. In my experience, dry film tenting 

>over holes holds up very well, even for holes large as 3mm. I use a wet 

>lamination method so the holes are actually filled with water.  I have 

>not tried hot roll lamination.


I checked film adhesion, it is rock solid. Actually problem is exactly at the center of the holes. When I look at the film before developing, I see that  film sucked in to the hole. Because of that center of the hole is far away from the surface and it gets less light energy.  This causes under exposed film at the center and inside  developing bath it starts to dissolve from that point. 
BTW I'm using LDI to expose the film.  


>Forget about pattern plating. I have been down that path and its 

>disadvantages outweigh advantages. A tin resist requires difficult to 

>maintain alkaline etchants. Also, tin plating solutions become depleted 

>by atmospheric oxidation when they are used infrequently. A Sn/Pb 

>plating bath may allow use of persulfate or peroxy sulfuric etchants but 

>again I believe you'll also have tin(II) oxidation problems.


I  agree it is a big hassle. 


>Overexposed dry film will become brittle , and could be a source of your 

>problem. Are the traces are holding up ok, and you find cracks in the 

>dry film covering the hole opening ?

>Is the resist lifting around the outside of the pad ?

If I increase exposure duration further this happens. Traces are always good but you can see cracks on hole openings. I didn't see any resist lifting problem outside the pad.
 
I think using your wet film method will solve film sucking problem, it will minimize pressure change inside the hole. I need to read your notes first before give a try.
Regards,
Volkan

--- On Sun, 1/10/10, Adam Seychell <a_seychell@...> wrote:
Show quoted textHide quoted text
From: Adam Seychell <a_seychell@...>
Subject: Re: [Homebrew_PCBs] Dry film tenting problem & pattern plating
To: Homebrew_PCBs@yahoogroups.com
Date: Sunday, January 10, 2010, 10:18 PM







 



  


    
      
      
      Volkan wrote:

>  

> 

> Hi,

> I'm facing dry film tenting problems. It couldn't protect THP holes and 

> tents start to break during developing. I did some googling and saw that 

> this problem is known and according to Dupont technical articles, it is 

> recommended to increase exposure duration to avoid tent break. I tried 

> it and I saw great improvement.

> Another recommendation was, to reduce roller pressure to avoid hole 

> sharp edge cutting of the film. It is stated that pressure in the holes 

> decreases after lamination and it sucks film (film is liquid during 

> lamination) to the holes and because of that, sharp hole edges cut the 

> film. This cut decreases film strength. Another advise was to decrease 

> the lamination temperature. I also tested both, they helped but didn't 

> solve the problem completely.

> 

> My second try was to use pattern plating method. I tried electroplated 

> tin as a resist and ammonium persulfate as an etcher, it didn't act as 

> an etch resist and etched away with copper.

> 

> Any ideas/suggestions or does anyone faced similar tenting problems?

> Which etcher can be used for tin or nickel etch resist? Is there any 

> practical formula for homebrewers?

> I'll appreciate a lot on any guidance.

> Thanks,

> 



I've been using tenting method with great success and is one of the few 

operations that have not cause me headaches. My first comment is that 

you have resist adhesion problems. In my experience, dry film tenting 

over holes holds up very well, even for holes large as 3mm. I use a wet 

lamination method so the holes are actually filled with water.  I have 

not tried hot roll lamination.



Forget about pattern plating. I have been down that path and its 

disadvantages outweigh advantages. A tin resist requires difficult to 

maintain alkaline etchants. Also, tin plating solutions become depleted 

by atmospheric oxidation when they are used infrequently. A Sn/Pb 

plating bath may allow use of persulfate or peroxy sulfuric etchants but 

again I believe you'll also have tin(II) oxidation problems.



Overexposed dry film will become brittle , and could be a source of your 

problem. Are the traces are holding up ok, and you find cracks in the 

dry film covering the hole opening ?

Is the resist lifting around the outside of the pad ?



Adam



    
     

    
    


 



  






      

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Re: [Homebrew_PCBs] Dry film tenting problem & pattern plating

2010-01-12 by Volkan Sahin

Hi Simao,
Thanks a lot for your reply. It contains full of information. I tried phosphoric acid + ammonium per-sulfate it works fine. It didn't etch the tin plated side of the copper. The problem is ammonium per-sulfate is very slow etcher and tin becomes black.  I'll try Adam's wet lamination method, I think it will  reduce pressure change inside the holes.

Regards,
Volkan  

--- On Fri, 1/8/10, Simao Cardoso <simaocardoso@gmail.com> wrote:
Show quoted textHide quoted text
From: Simao Cardoso <simaocardoso@...>
Subject: Re: [Homebrew_PCBs] Dry film tenting problem & pattern plating
To: "Homebrew_PCBs@yahoogroups.com" <Homebrew_PCBs@yahoogroups.com>
Cc: "Simao Cardoso" <simaocardoso@...>
Date: Friday, January 8, 2010, 4:00 PM







 



  


    
      
      
      Simao Cardoso wrote:

> I think that in 'printed circuits handbook' is written that adding

> phosphoric acid to ammonia persulfate makes it tin compatible i will

> try to check that too. 



refered on this page

http://books. google.pt/ books?id= 1Pbkeu6dZ_ sC&pg=SA34- PA3

more on this page

http://books. google.pt/ books?id= 1Pbkeu6dZ_ sC&pg=SA34- PA16

the page before is also on-topic



Google is easier than the heavy book :>



To Volkan Sahin:



Trying to find a recipe got me to really old patents like 3476624 (1969)

where 2.25% phosphoric acid is added to a 25% solution of ammonium

persulfate, among a prohibited hazard etch accelerator. And later claim

that 0.5% to 15% phosphoric acid leaves the solder usable. You must know

this will leave the plated pure tin black.



While googling more 3 old patents came out 4419183 4636282 4130454, all

using Sulfuric acid, Hydrogen Peroxide (35%), Phenolsulfonic acid, not

tin compatible but tin compatible patents differ in the 5% phosphoric

acid and some not important things to a chemistry ignorant like me.



If you wish to try any off this, phosphoric acid can be bought as rust

remover, in almost anyplace where inks are sold. The one i got only says

about content 'contains solution of phosphoric acid', it's like a

yellowish gel that dries in to a white paste.

The 1L bottle of 85% phosphoric acid i got from the drug store it's less

yellowish, almost as low viscous as water. So the rust remover must have

a thicker but guessing that is something non hazard, cheap additive,

maybe it's PVP and maybe won't interfere in the etch.



But if you accept any advise from me. If you are doing this to test your

incredible good and fast UV laser raster flatbed printer. Using it with

laminated dry film, pattern plating, metallic resist plating and

metallic resist compatible etchant, won't make your machine so

incredible if you have to go trough all this. It's required if inkjet

used, but with laser direct print you should use LPI resist and CuCl

etchant and enjoy some free time and effort. And a repeatable process

for soldermak.



Can you get acrylic resin? Isn't expensive, mine was 5eur a 1L bottle. I

bought it on one supermarket (as we call those stores here) where i also

buy food, household things and so. Don't know what for people buy this

but bottle says 'used to make inks and to brighten hood floor'. The

benzophenone, ebay last item, was 260452044449, contact seller it may

still have it. He/she is listing the 50 packages off it from July at

least and only sold a few. I would bought it and oversea price given was

good, but unfortunately i asked customs if they will consider it as drug

or ask laboratory test and it went from office to office up to the

government secretary responsibly and no one know to answer. Local

chemical suppliers all ignore me. But this should be a good homebrew ink

to use in the epson print head, i passed acrylic resin with a syringe in

a hp head using those special clips and it passes like water. 

I don't have a recipe from a book to make the resist but should be 5%

photoinitiator like in pva dichromated. 



Recently when searching for a copper plating additives supplier i was

impressed by Atotech. (They are also in US) And don't only have the

chemicals to plating and finishings but also LPI resists soldermask and

one part legend.  (Among things that make phophorizated copper anodes

and anode bags in PTH useless) With my luck with chemical suppliers i

didn't yet stop on the near by store but i hope they be better. 



Good luck! 





    
     

    
    


 



  






      

[Non-text portions of this message have been removed]

Re: [Homebrew_PCBs] Dry film tenting problem & pattern plating

2010-01-12 by Adam Seychell

Volkan Sahin wrote:
>  
> 
> Hi Simao,
> Thanks a lot for your reply. It contains full of information. I tried 
> phosphoric acid + ammonium per-sulfate it works fine. It didn't etch the 
> tin plated side of the copper. The problem is ammonium per-sulfate is 
> very slow etcher and tin becomes black.  I'll try Adam's wet lamination 
> method, I think it will  reduce pressure change inside the holes.
> 
> Regards,
> Volkan 

A long time ago I tried doing what your doing. I couldn't get persulfate 
etchant to stop attacking the tin plating. I found that if I left the 
tin in dry air for 24 hours then an invisible oxide coating would form 
and could prevent complete etchant attack. The tin would be still be 
dark and patchy. I concluded it wasn't going to work. I think the 
phosphoric acid helped, but it wasn't what I called a successful fix. 
Alkaline etchants is the only way to go for pure a tin metal resists.

Normal practice it to use solder metal resist with persulfate or 
sulfuric peroxide etchant, and then reflow the solder in an oil bath.

Adam

Re: [Homebrew_PCBs] Dry film tenting problem & pattern plating

2010-01-12 by Simao Cardoso

Volkan Sahin wrote:

> Hi Simao,
> Thanks a lot for your reply. It contains full of information. I tried
> phosphoric acid + ammonium per-sulfate it works fine. It didn't etch
> the tin plated side of the copper. The problem is ammonium per-sulfate
> is very slow etcher and tin becomes black.  I'll try Adam's wet
> lamination method, I think it will  reduce pressure change inside the
> holes.

I was to say something more about tin compatible etchants, since is also
in my interest that you success in this, but it has the good answer
already. You will find better expertise and greater methods in Adam
Seychell writings than i found using 75K eur off bungard equipment. 

And this should be corrected. Dry film MSDS and wikipedia says something
like Acrilics and benzophenone, which i sadly mentioned. But only very
specific and odd compounds will work in low concentrations and sensitive
enough. 
Knowing the top plastic film in dry film function as oxygen blocking,
avoiding it's inhibition, I should never consider similar things as
liquid in free air. 
Thanks for your sharing, 
Sim�o

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