I didn't understand what you are saying there. Anyway I made it plenty clear that my information about this etchant is very thin indeed. ST On Fri, Jan 8, 2010 at 1:47 PM, Simao Cardoso <simaocardoso@...> wrote: > Volkan Sahin wrote: > >> >> It seems peroxy-sulfuric etcher won't etch tin etch resist and it is >> possible to obtain stabilizer from think&tinker in low volume. > > > > I don't know why Stefan Trethan says that, i also said lots of very > wrong things in here already, but is really bad when we induce people in > mistake. > > The peroxy-sulfuric will etch tin without additives. The stabilizer is > for the 35% - 50% hydrogen peroxide don't decompose in explosion when > you put a copper board in there. > > I also wish to use a sulfuric based etchant but not like this. > Did you read the patents i mentioned? > > >
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Re: [Homebrew_PCBs] Dry film tenting problem & pattern plating
2010-01-08 by Stefan Trethan
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