Stefan Trethan wrote: > > Well, one would have to dig out the discussion from a few years ago to > see the details. I should do it too, but in another moment off non confirmed comments; if i read it right or if is still used the stabilizer for peroxide decomposition are phenol compounds. If Phenolsulfonic acid is used should stabilize peroxide and protect tin. If so makes the think&tinker stabilizer useful in both ways. Since non ammonia etchants compatible with tin resist use phosphoric acid and derivatives to protect tin. (no experience just read it). I think that in 'printed circuits handbook' is written that adding phosphoric acid to ammonia persulfate makes it tin compatible i will try to check that too. The last off the patents i mentioned shows nitric as oxidizer in small amount on a mixture of sulphuric and phosphoric acid (among other stuff), making a tin compatible etchant. Since is easier to get nitric acid than high concentration peroxide it may be a nice candidate. But although i have it all in my house i never try it...
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Re: [Homebrew_PCBs] Dry film tenting problem & pattern plating
2010-01-08 by Simao Cardoso
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