Volkan Sahin wrote: > > It seems peroxy-sulfuric etcher won't etch tin etch resist and it is > possible to obtain stabilizer from think&tinker in low volume. I don't know why Stefan Trethan says that, i also said lots of very wrong things in here already, but is really bad when we induce people in mistake. The peroxy-sulfuric will etch tin without additives. The stabilizer is for the 35% - 50% hydrogen peroxide don't decompose in explosion when you put a copper board in there. I also wish to use a sulfuric based etchant but not like this. Did you read the patents i mentioned?
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Re: [Homebrew_PCBs] Dry film tenting problem & pattern plating
2010-01-08 by Simao Cardoso