Modular Synth Panels

1) When using leaded solder you should wipe the tip clean before you turn 
the iron off. With lead-free you should clean the tip and then flow some 
solder on to it and then turn it off.
2) Some users prefer using stranded steel cleaners instead of a damp sponge 
as this (a) does not reduce the tip temperature as much and (b) has a better 
cleaning action
3) Lead-free solder WILL eat through your tips quicker so be prepared to 
replace more often
4) A build up of black residue is through oxidation of the solder and tip. 
Regular cleaning during the soldering process should minimize this. If it 
becomes excessive then it probably indicates the need for a new tip
5) Look around at the variety of lead-flux mixes. Experiment and find one 
that works well for your environment and tools. Aggressive fluxes make 
soldering easier but can attack the board, components and iron if not 
cleaned properly.
6) You will need to clean your tip during the soldering stage, more often 
with lead-free solder although it is good practise to clean every 2 or 3 
steps.
7) Don't use a WET sponge, use a damp one and keep topping it up. Too much 
water will drop the tip temperature which will cause bad soldering on the 
next joint unless you wait for the tip to re-stabilise.
8) There is NO reason why EVERYONE shouldn't be using lead-free solder now!. 
It does take a bit more effort to get it going but the correct choice of 
solder/flux, tip and good habits usually addresses most problems.

Best Regards

(Mr) Laurie Biddulph
Phone: +61 (0)2 4340 0938
Mobile: 0400 257 645

Elby Designs
ABN: 70 022 727 605
http://www.elby-designs.com

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----- Original Message ----- 
From: "joshdaigleusa" <taviny@...>
To: <ModularSynthPanels@yahoogroups.com>
Sent: Sunday, January 04, 2009 5:24 AM
Subject: [ModularSynthPanels] Re: on soldering


> Here's the main thing I'd like advice on with soldering. I've ruined a
> few tips so must not be tinning/cleaning correctly. I have a little
> container of the Radio Shack tip tinner. What I do is fire up my iron,
> dip it in the tinner, wipe the excess off on a damp sponge, solder,
> wipe on damp sponge and then dip in tinner. It then sits for a few
> seconds while I get the next component ready, I then wipe on damp
> sponge, solder, repeat... Eventually parts of my tips have started to
> turn black and won't heat up so I have to replace them. 2 things I'm
> wondering about are when I'm done soldering I wipe on sponge, tin it
> pretty well, then turn the iron off. Should I not tin the tip before
> turning off for the night or whatever? Also, the stuff in the tinner
> container starts to look pretty nasty, and the way I use it is to
> submerge the tip and get it pretty heavily coated - is this correct?
> Are you more supposed to wipe along the surface, as you would with a
> sponge, and not use the sponge at all?
>
>
> ------------------------------------
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