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[Homebrew_PCBs] Quimical VIAs

[Homebrew_PCBs] Quimical VIAs

2010-12-13 by Vicent Colomar Prats

Hi all,

Does anybody know or use an affordable and easy way, from the hobby (not
professional) point of view, to create doble-sided VIAs or Pads? I use the
technique of a thin wire sodded by both sides, but it's very slow and I
can't do it under soic or tqfp pakages nor in small diametres. I use double
sided pcbs with smd 0805, and very rarely 0603, components and soic and tqfp
ics. I would like to reduce size in pcbs, but it is mandatory, for that
goal, to use very small vias under ics, but I'm not able at the moment.

No matter if this is a technique, a comercial kit or a tool/machine. Also, I
can afford some hundred $$/�� in it if it is worth the job, but never go to
the thousand range. It is just hobby robotics what I do.

Greetings.


[Non-text portions of this message have been removed]

Re: [Homebrew_PCBs] Quimical VIAs

2010-12-15 by Vicent Colomar Prats

Any info on double-sided metallized pads or vias?

2010/12/13 Vicent Colomar Prats <vicentecolomar@...>

> Hi all,
>
> Does anybody know or use an affordable and easy way, from the hobby (not
> professional) point of view, to create doble-sided VIAs or Pads? I use the
> technique of a thin wire sodded by both sides, but it's very slow and I
> can't do it under soic or tqfp pakages nor in small diametres. I use double
> sided pcbs with smd 0805, and very rarely 0603, components and soic and tqfp
> ics. I would like to reduce size in pcbs, but it is mandatory, for that
> goal, to use very small vias under ics, but I'm not able at the moment.
>
> No matter if this is a technique, a comercial kit or a tool/machine. Also,
> I can afford some hundred $$/�� in it if it is worth the job, but never go
> to the thousand range. It is just hobby robotics what I do.
>
> Greetings.
>


[Non-text portions of this message have been removed]

Re: [Homebrew_PCBs] Quimical VIAs

2010-12-15 by Donald H Locker

I have no personal experience.  I think a plated-through-holes (PTH) process is usually a bit beyond the hobbyist level, but is the only way of achieving no-bulge vias.  All other methods (eyelets, fine-gauge wire) leave protrusions on the surface that prevent flat mounting of components.

It _might_ be possible to put down a pad with a slot in the copper (extending radially from the hole) just wide enough to lay a fine gauge wire in and bridge the pad's slot and the wire with solder, producing a nearly-flat surface, but I wouldn't want to do many of those.  Never mind.  1oz copper is about 0.0013 inches thick, while 30AWG wire is 0.010 inch diameter - that's about a 0.009 inch ridge on the board.

Donald.
--
*Plain Text* email -- it's an accessibility issue
()  no proprietary attachments; no html mail
/\  ascii ribbon campaign - <www.asciiribbon.org>

----- Original Message -----
Show quoted textHide quoted text
> From: "Vicent Colomar Prats" <vicentecolomar@...>
> To: "Homebrew PCBs" <Homebrew_PCBs@yahoogroups.com>
> Sent: Wednesday, December 15, 2010 4:35:26 AM
> Subject: Re: [Homebrew_PCBs] Quimical VIAs
> 
> Any info on double-sided metallized pads or vias?
> 
> 2010/12/13 Vicent Colomar Prats <vicentecolomar@...>
> 
> > Hi all,
> >
> > Does anybody know or use an affordable and easy way, from the hobby
> (not
> > professional) point of view, to create doble-sided VIAs or Pads? I
> use the
> > technique of a thin wire sodded by both sides, but it's very slow
> and I
> > can't do it under soic or tqfp pakages nor in small diametres. I use
> double
> > sided pcbs with smd 0805, and very rarely 0603, components and soic
> and tqfp
> > ics. I would like to reduce size in pcbs, but it is mandatory, for
> that
> > goal, to use very small vias under ics, but I'm not able at the
> moment.
> >
> > No matter if this is a technique, a comercial kit or a tool/machine.
> Also,
> > I can afford some hundred $$/�� in it if it is worth the job, but
> never go
> > to the thousand range. It is just hobby robotics what I do.
> >
> > Greetings.
> >
> 
> 
> [Non-text portions of this message have been removed]
> 
> 
> 
> ------------------------------------
> 
> Be sure to visit the group home and check for new Links, Files, and
> Photos:
> http://groups.yahoo.com/group/Homebrew_PCBsYahoo! Groups Links
> 
> 
>

Re: [Homebrew_PCBs] Quimical VIAs

2010-12-15 by Vicent Colomar Prats

Hi Donald,

I think your idea of putting a thin wire in a slotted pad could work, but it
is going to be a lot of work. A friend of mine also tried to flat the vias
(normal ones with a simple piece of wire) with a dremel and did a good job.
It is also a lot of work but never did it enought to put an IC on top of
those vias.

Another idea I have, but not tried yet, is with sodder paste. First try one
side, then the other. Or maybe helped with a very thin wire in the hole?
Anybody tried something similar?

Anyway, some of this "inventions" can work with more o less result, but I'm
convinced the way is to go to a quimical or electrolytical plated process.
Is there anything affordable for the hobbyier?

2010/12/15 Donald H Locker <dhlocker@...>

>
>
> I have no personal experience. I think a plated-through-holes (PTH) process
> is usually a bit beyond the hobbyist level, but is the only way of achieving
> no-bulge vias. All other methods (eyelets, fine-gauge wire) leave
> protrusions on the surface that prevent flat mounting of components.
>
> It _might_ be possible to put down a pad with a slot in the copper
> (extending radially from the hole) just wide enough to lay a fine gauge wire
> in and bridge the pad's slot and the wire with solder, producing a
> nearly-flat surface, but I wouldn't want to do many of those. Never mind.
> 1oz copper is about 0.0013 inches thick, while 30AWG wire is 0.010 inch
> diameter - that's about a 0.009 inch ridge on the board.
>
> Donald.
> --
> *Plain Text* email -- it's an accessibility issue
> () no proprietary attachments; no html mail
> /\ ascii ribbon campaign - <www.asciiribbon.org>
>
>


[Non-text portions of this message have been removed]

Re: [Homebrew_PCBs] Quimical VIAs

2010-12-15 by Simon Gornall

On 15 Dec 2010, at 07:39, Vicent Colomar Prats wrote:

> Hi Donald,
> 
> I think your idea of putting a thin wire in a slotted pad could work, but it
> is going to be a lot of work. A friend of mine also tried to flat the vias
> (normal ones with a simple piece of wire) with a dremel and did a good job.
> It is also a lot of work but never did it enought to put an IC on top of
> those vias.
> 
> Another idea I have, but not tried yet, is with sodder paste. First try one
> side, then the other. Or maybe helped with a very thin wire in the hole?
> Anybody tried something similar?
> 
I mill out PCBs at home using my Everprecision 2002 machine, and then I make connections with solder-paste. Using paste is a lot faster than using solder IMHO - takes about 3 secs/hole.

You can't just use solder-paste though. It wicks away from the center-hole and you don't get an electrical connection through the FR4. My method is:

	- lay out the vias using squares rather than circles - it makes it easier to see which ones are vias :)
	- put a blob of solder-paste on each square via
		- poke a thin-gauge wire through the hole, touch the soldering iron to the paste, move the iron away then wait for the solder to 'set'
		- snip the wire
		- repeat for each via

	- turn the board over, put a blob of solder-paste on each via
	- touch the paste with the soldering iron

	(optionally) turn the board over again to the component-side
	melt each via with the soldering iron and push the wire through so it sticks out the reverse side, not the component side
	drag the iron down the copper trace to smooth out the solder

The optional stage can make the surface on the component side pretty smooth - not perfect though, and I wouldn't like to put any SMT chips on top of that sort of via

I was recently looking at plated-through-holes myself. I found the LPKF solution (circa $10k), or a Chinese PTH machine (circa $1400 + $500 shipping). The Chinese one is not a pulse-plating system, it's just a DC plating machine. 

So, I thought about how to DIY one of these. LPKF will sell the chemistry in small doses (it'll still cost you $300 or so I reckon, but that's "small" :), so that's not an issue. I'm busy with other projects (my reef tank started leaking, and I have to re-install everything. A 240-gallon fishtank takes a lot of time to set up properly :) at the moment, so it hasn't got very far, but I put up the design at http://platepcb.com/ 

The SSR's will arrive in January next year, so perhaps I'll have a chance to work on it then.

Apart from the chemistry, you're still looking at the high-hundreds for a reverse-pulse-plating machine if you DIY it. I can't see the price being much more "affordable" than that if it's sold commercially.

Simon

(BTW: What on earth does 'quimical' mean ?)


> 
> Anyway, some of this "inventions" can work with more o less result, but I'm
> convinced the way is to go to a quimical or electrolytical plated process.
> Is there anything affordable for the hobbyier?
> 
> 2010/12/15 Donald H Locker <dhlocker@...>
> 
> >
> >
> > I have no personal experience. I think a plated-through-holes (PTH) process
> > is usually a bit beyond the hobbyist level, but is the only way of achieving
> > no-bulge vias. All other methods (eyelets, fine-gauge wire) leave
> > protrusions on the surface that prevent flat mounting of components.
> >
> > It _might_ be possible to put down a pad with a slot in the copper
> > (extending radially from the hole) just wide enough to lay a fine gauge wire
> > in and bridge the pad's slot and the wire with solder, producing a
> > nearly-flat surface, but I wouldn't want to do many of those. Never mind.
> > 1oz copper is about 0.0013 inches thick, while 30AWG wire is 0.010 inch
> > diameter - that's about a 0.009 inch ridge on the board.
> >
> > Donald.
> > --
> > *Plain Text* email -- it's an accessibility issue
> > () no proprietary attachments; no html mail
> > /\ ascii ribbon campaign - <www.asciiribbon.org>
> >
> >
> 
> [Non-text portions of this message have been removed]
> 
> 



[Non-text portions of this message have been removed]

Re: [Homebrew_PCBs] Quimical VIAs

2010-12-15 by DJ Delorie

Hmmm... I wonder...

pre-drill the via holes (or all of them I suppose) to match some wire
you have.  Push wire through and clip, so that it sticks out a little on
each end (as little as possible, or just re-trim them after the plating
step).

Now use a plain copper plating bath to fuse the wires to the copper
clad.

grind/lap any copper sticking out to re-smooth the clad for etching.

If one were clever, one could "float" the pcb on the plating bath, so
that it only plates around the vias and not the whole copper surface.
You'd have to do both sides though.  Or only put anodes to one side of
the pcb, and electrically connect the other side.

Re: [Homebrew_PCBs] Quimical VIAs

2010-12-15 by Donald H Locker

I'm confused about what quimical is.  I can't find that in any dictionary.  Do you mean chemical?  Done with chemistry?

Donald.
--
*Plain Text* email -- it's an accessibility issue
()  no proprietary attachments; no html mail
/\  ascii ribbon campaign - <www.asciiribbon.org>

----- Original Message -----
Show quoted textHide quoted text
> From: "Vicent Colomar Prats" <vicentecolomar@...>
> To: "Homebrew PCBs" <Homebrew_PCBs@yahoogroups.com>
> Sent: Wednesday, December 15, 2010 10:39:47 AM
> Subject: Re: [Homebrew_PCBs] Quimical VIAs
> 
> Hi Donald,
> 
> I think your idea of putting a thin wire in a slotted pad could work, but it
> is going to be a lot of work. A friend of mine also tried to flat the vias
> (normal ones with a simple piece of wire) with a dremel and did a good job.
> It is also a lot of work but never did it enought to put an IC on top of
> those vias.
> 
> Another idea I have, but not tried yet, is with sodder paste. First try one
> side, then the other. Or maybe helped with a very thin wire in the hole?
> Anybody tried something similar?
> 
> Anyway, some of this "inventions" can work with more o less result, but I'm
> convinced the way is to go to a quimical or electrolytical plated process.
> Is there anything affordable for the hobbyier?
> 
> 2010/12/15 Donald H Locker <dhlocker@...>

Re: [Homebrew_PCBs] Quimical VIAs

2010-12-15 by Simao Cardoso

Simon Gornall wrote:



> 
> (BTW: What on earth does 'quimical' mean ?)
> 
It should be a typo for 'chemical' since in both Portuguese and Spanish
chemistry is spelled as 'qu�mica' (quimica for non-utf8 users), and
Vicent seems Spanish name. I am Portuguese and didn't even realize the
typo until you did ;)


So about chemical vias (and skipping all mechanical methods) the ones
that can be 'homebrewed' are palladium and carbon black. But is more
difficult the copper plating bath itself. There is a really great method
found by a great mind of homebrew PTH but he never shared it here. That
Chinese machine Simon posted seems to be built around the same trick, it
will take 75 to 90 min to plate a pcb but is fair simple to build. I
really am the 'flag-boy' for palladium since it's much simpler to use
than carbon black (all wet vs 2 times drying), and super trustful (i
made thousands of boards with palladium without missing a hole) and
longer bath life (years vs months). Posting recipes will be bad faith
since i haven't homebrew experience in either. Both are fair simple,
both have a similar to industrial degreaser conditioner, a ionic
suspension for one or in surfactant in other for activation and a ion
remover with copper as accelerator for palladium or a common simple
micro etch for carbon black. Of course that during last year i tried to
get everything needed for the palladium chemistry and still miss some
stuff (sh*t really happens...).

I moved and am living away from where i have all my tools and stuff and
so not much progress on this, but for construct it the acrylic glass
with solvent is amazing, even if you cut the acrylic with 1 mm breaches,
multiple passes of solvent fill the holes. I tried both store expensive
solvent (it says dichloromethane and nitroethane) and pure
dichloromethane cheap from eBay. With 100eur for a 3 sq meter 5mm thick
sheet is fair cheap to build (there is two types and only one works with
the solvent). 


THE SIMPLEST method i know about (and wish to try one day) is the good
simple plating setup from one person with also his sharing from 12 years
ago about drilling holes above graphite powder. There is some reference
from IPC about this but never disclose what can be used under the pcb.
Graphite chemistry is just like carbon black but almost 1000 times more
conductive per hole with one pass only, but can last one day only if
additives are used. Using it on a CNC is dumb but a simple drill press
with a deep pool for powder seems to worth the money to try it.

> 
> Apart from the chemistry, you're still looking at the high-hundreds for a reverse-pulse-plating machine if you DIY it.

Simon, i looked into your descriptions. Reverse pulse can be really good
but neither do you seem to full understand it either is a
simple/complete answer. I am also building my driver, also with a avr,
but with very low RDSon FETs (and fet drivers), using 4 psu's and 8 fets
(multiple anodes and cathodes) for a tricky chemistry (big expectations
in it). But for example i never figure out which voltage is appropriate
for the reverse pulse. You don't seem to realize it but it all goes
around current densities on surface vesus hole. And the magic number is
3 (or higher) - 3 times shorter reverse pulse, 3 times much current. For
_SLAPPING_ copper from surface and leave holes without touch, using same
values for both is wasting energy. You need at least 3V for plate pcb's
nicely, but since the common setup uses additives to require voltage
increase as current increases (without them current goes exponential
above ~0.7V) there isn't document proof on which voltage to use (or
known which psu to buy). Commercial systems say 12-20V capable but thats
crazy it will electrolise water. Ohh and i am having big trouble on this
so the avr changes voltage and current limits at cheap switched mode
psu's. 

And thats all for quimical vias :D
Simao
Show quoted textHide quoted text
> 
> 
> > 
> > Anyway, some of this "inventions" can work with more o less result, but I'm
> > convinced the way is to go to a quimical or electrolytical plated process.
> > Is there anything affordable for the hobbyier?
> > 
> > 2010/12/15 Donald H Locker <dhlocker@...>
> > 
> > >
> > >
> > > I have no personal experience. I think a plated-through-holes (PTH) process
> > > is usually a bit beyond the hobbyist level, but is the only way of achieving
> > > no-bulge vias. All other methods (eyelets, fine-gauge wire) leave
> > > protrusions on the surface that prevent flat mounting of components.
> > >
> > > It _might_ be possible to put down a pad with a slot in the copper
> > > (extending radially from the hole) just wide enough to lay a fine gauge wire
> > > in and bridge the pad's slot and the wire with solder, producing a
> > > nearly-flat surface, but I wouldn't want to do many of those. Never mind.
> > > 1oz copper is about 0.0013 inches thick, while 30AWG wire is 0.010 inch
> > > diameter - that's about a 0.009 inch ridge on the board.
> > >
> > > Donald.
> > > --
> > > *Plain Text* email -- it's an accessibility issue
> > > () no proprietary attachments; no html mail
> > > /\ ascii ribbon campaign - <www.asciiribbon.org>
> > >
> > >
> > 
> > [Non-text portions of this message have been removed]
> > 
> > 
> 
> 
> 
> [Non-text portions of this message have been removed]
>

Re: [Homebrew_PCBs] Quimical VIAs

2010-12-15 by Larry Battraw

On Wed, Dec 15, 2010 at 4:19 PM, Simao Cardoso <simaocardoso@...> wrote:
>
> So about chemical vias (and skipping all mechanical methods) the ones
> that can be 'homebrewed' are palladium and carbon black. But is more
> difficult the copper plating bath itself. There is a really great method
> found by a great mind of homebrew PTH but he never shared it here. That
> Chinese machine Simon posted seems to be built around the same trick, it
> will take 75 to 90 min to plate a pcb but is fair simple to build. I
> really am the 'flag-boy' for palladium since it's much simpler to use
> than carbon black (all wet vs 2 times drying), and super trustful (i
> made thousands of boards with palladium without missing a hole) and
> longer bath life (years vs months). Posting recipes will be bad faith
> since i haven't homebrew experience in either. Both are fair simple,
> both have a similar to industrial degreaser conditioner, a ionic
> suspension for one or in surfactant in other for activation and a ion
> remover with copper as accelerator for palladium or a common simple
> micro etch for carbon black. Of course that during last year i tried to
> get everything needed for the palladium chemistry and still miss some
> stuff (sh*t really happens...).


This sounds very interesting since you've had actual experience using
these types of chemistries.  Would you mind telling how you used them
as far as how you got your experience with them?  Posting the recipe
for anything is always informative even if homebrew people can't
always get the same ingredients needed.  I've looked at a lot of
patent applications and the chemicals used are often very difficult to
find, so I know how it can be.
(snip)

> THE SIMPLEST method i know about (and wish to try one day) is the good
> simple plating setup from one person with also his sharing from 12 years
> ago about drilling holes above graphite powder. There is some reference
> from IPC about this but never disclose what can be used under the pcb.
> Graphite chemistry is just like carbon black but almost 1000 times more
> conductive per hole with one pass only, but can last one day only if
> additives are used. Using it on a CNC is dumb but a simple drill press
> with a deep pool for powder seems to worth the money to try it.

Are you talking about covering a board with graphite powder and then
drilling the holes, such that the powder falls in and coats the
hole-walls as they are drilled?  It's not clear exactly what is going
on, as you also talk about "graphite chemistry".  Please let us know a
little bit more about how this is done.

> >
> > Apart from the chemistry, you're still looking at the high-hundreds for a reverse-pulse-plating machine if you DIY it.
>
> Simon, i looked into your descriptions. Reverse pulse can be really good
> but neither do you seem to full understand it either is a
> simple/complete answer. I am also building my driver, also with a avr,
> but with very low RDSon FETs (and fet drivers), using 4 psu's and 8 fets
> (multiple anodes and cathodes) for a tricky chemistry (big expectations
> in it). But for example i never figure out which voltage is appropriate
> for the reverse pulse. You don't seem to realize it but it all goes
> around current densities on surface vesus hole. And the magic number is
> 3 (or higher) - 3 times shorter reverse pulse, 3 times much current. For
> _SLAPPING_ copper from surface and leave holes without touch, using same
> values for both is wasting energy. You need at least 3V for plate pcb's
> nicely, but since the common setup uses additives to require voltage
> increase as current increases (without them current goes exponential
> above ~0.7V) there isn't document proof on which voltage to use (or
> known which psu to buy). Commercial systems say 12-20V capable but thats
> crazy it will electrolise water. Ohh and i am having big trouble on this
> so the avr changes voltage and current limits at cheap switched mode
> psu's.

Thanks for the detail you've given on this.  I figured using something
like an H-bridge with MOSFETs would do it but it sounds like it's more
involved if you have to use reverse voltages that are different than
the positive plating voltage.  Have you had any success doing this
type of plating or has it not worked out very well?  What are some of
the problems you've run into?

Thanks-
Larry

Re: [Homebrew_PCBs] Quimical VIAs

2010-12-15 by Simon Gornall

On 15 Dec 2010, at 13:19, Simao Cardoso wrote:
> 
> 
> 
> Simon, i looked into your descriptions. Reverse pulse can be really good
> but neither do you seem to full understand it either is a
> simple/complete answer.
> 

Oh, I'll easily admit I don't fully understand everything I need to know for this :) Yet :)
 
> I am also building my driver, also with a avr,
> but with very low RDSon FETs (and fet drivers), using 4 psu's and 8 fets
> (multiple anodes and cathodes) for a tricky chemistry (big expectations
> in it). But for example i never figure out which voltage is appropriate
> for the reverse pulse.
> 
My understanding was that you tend to vary either current or voltage in the pulses (so a constant-voltage, varying current supply would be ok). The CAT4101 has a wide range of voltage over which it will work (2-24v), so I'm covered, as long as a constant supply level at varying current is ok.

> You don't seem to realize it but it all goes
> around current densities on surface vesus hole. And the magic number is
> 3 (or higher) - 3 times shorter reverse pulse, 3 times much current. For
> _SLAPPING_ copper from surface and leave holes without touch, using same
> values for both is wasting energy.
> 
Ok - I'd seen 2x rather than 3x, but ok. I was aware it ought to be different, that was why there are 15 CAT4101's in the forward direction and 30 of them in the reverse direction. I wasn't actually planning on running them at max output, and the current ought to be a function of the board area anyway, right ?

So yes, I was planning on 2x the current, 0.5x the pulse-width in the reverse direction. If you're saying 3x current and 0.33x the pulse-width, well, that's an easy scale-up :)

> You need at least 3V for plate pcb's
> nicely, but since the common setup uses additives to require voltage
> increase as current increases (without them current goes exponential
> above ~0.7V) there isn't document proof on which voltage to use (or
> known which psu to buy). Commercial systems say 12-20V capable but thats
> crazy it will electrolise water. Ohh and i am having big trouble on this
> so the avr changes voltage and current limits at cheap switched mode
> psu's. 
> 
Right - I was planning on using the 5v supply on an ATX PSU and see where that got me. If I get burning, I'll reduce the voltage/current. If I get nothing, I'll increase the voltage (dropping it from the 12v supply on the PSU down to 6, 8, 10 etc. using a simple voltage divider and big resistors) and see what I can do. It's a relatively small investment for me (apart from the chemistry from LPKF) because I have a lot of the stuff on-hand. I use CAT4101's in LED drivers, and I have a spare 50 or so of them lying around :)

Simon


[Non-text portions of this message have been removed]

Re: [Homebrew_PCBs] Quimical VIAs

2010-12-16 by Donald H Locker

Aha!  Thank you.  I almost didn't get to chemical until sending my question, then the light bulb started to glow.  Now all is clear.

Thanks for the information about hole activation, too.  Some day, I'll give it a try.  I've done some plating, but never PCB holes.

Donald.
--
*Plain Text* email -- it's an accessibility issue
()  no proprietary attachments; no html mail
/\  ascii ribbon campaign - <www.asciiribbon.org>

----- Original Message -----
Show quoted textHide quoted text
> From: "Simao Cardoso" <simaocardoso@...>
> To: "Homebrew PCBs" <Homebrew_PCBs@yahoogroups.com>
> Sent: Wednesday, December 15, 2010 4:19:22 PM
> Subject: Re: [Homebrew_PCBs] Quimical VIAs
> 
> Simon Gornall wrote:
> 
> 
> 
> > 
> > (BTW: What on earth does 'quimical' mean ?)
> > 
> It should be a typo for 'chemical' since in both Portuguese and
> Spanish
> chemistry is spelled as 'química' (quimica for non-utf8 users), and
> Vicent seems Spanish name. I am Portuguese and didn't even realize
> the
> typo until you did ;)
> 
> 
> So about chemical vias (and skipping all mechanical methods) the ones
> that can be 'homebrewed' are palladium and carbon black. But is more
> difficult the copper plating bath itself. There is a really great
> method
> found by a great mind of homebrew PTH but he never shared it here.
> That
> Chinese machine Simon posted seems to be built around the same trick,
> it
> will take 75 to 90 min to plate a pcb but is fair simple to build. I
> really am the 'flag-boy' for palladium since it's much simpler to use
> than carbon black (all wet vs 2 times drying), and super trustful (i
> made thousands of boards with palladium without missing a hole) and
> longer bath life (years vs months). Posting recipes will be bad faith
> since i haven't homebrew experience in either. Both are fair simple,
> both have a similar to industrial degreaser conditioner, a ionic
> suspension for one or in surfactant in other for activation and a ion
> remover with copper as accelerator for palladium or a common simple
> micro etch for carbon black. Of course that during last year i tried
> to
> get everything needed for the palladium chemistry and still miss some
> stuff (sh*t really happens...).
> 
> I moved and am living away from where i have all my tools and stuff
> and
> so not much progress on this, but for construct it the acrylic glass
> with solvent is amazing, even if you cut the acrylic with 1 mm
> breaches,
> multiple passes of solvent fill the holes. I tried both store
> expensive
> solvent (it says dichloromethane and nitroethane) and pure
> dichloromethane cheap from eBay. With 100eur for a 3 sq meter 5mm
> thick
> sheet is fair cheap to build (there is two types and only one works
> with
> the solvent). 
> 
> 
> THE SIMPLEST method i know about (and wish to try one day) is the
> good
> simple plating setup from one person with also his sharing from 12
> years
> ago about drilling holes above graphite powder. There is some
> reference
> from IPC about this but never disclose what can be used under the
> pcb.
> Graphite chemistry is just like carbon black but almost 1000 times
> more
> conductive per hole with one pass only, but can last one day only if
> additives are used. Using it on a CNC is dumb but a simple drill
> press
> with a deep pool for powder seems to worth the money to try it.
> 
> > 
> > Apart from the chemistry, you're still looking at the high-hundreds
> for a reverse-pulse-plating machine if you DIY it.
> 
> Simon, i looked into your descriptions. Reverse pulse can be really
> good
> but neither do you seem to full understand it either is a
> simple/complete answer. I am also building my driver, also with a
> avr,
> but with very low RDSon FETs (and fet drivers), using 4 psu's and 8
> fets
> (multiple anodes and cathodes) for a tricky chemistry (big
> expectations
> in it). But for example i never figure out which voltage is
> appropriate
> for the reverse pulse. You don't seem to realize it but it all goes
> around current densities on surface vesus hole. And the magic number
> is
> 3 (or higher) - 3 times shorter reverse pulse, 3 times much current.
> For
> _SLAPPING_ copper from surface and leave holes without touch, using
> same
> values for both is wasting energy. You need at least 3V for plate
> pcb's
> nicely, but since the common setup uses additives to require voltage
> increase as current increases (without them current goes exponential
> above ~0.7V) there isn't document proof on which voltage to use (or
> known which psu to buy). Commercial systems say 12-20V capable but
> thats
> crazy it will electrolise water. Ohh and i am having big trouble on
> this
> so the avr changes voltage and current limits at cheap switched mode
> psu's. 
> 
> And thats all for quimical vias :D
> Simao
> 
> > 
> > 
> > > 
> > > Anyway, some of this "inventions" can work with more o less
> result, but I'm
> > > convinced the way is to go to a quimical or electrolytical plated
> process.
> > > Is there anything affordable for the hobbyier?
> > > 
> > > 2010/12/15 Donald H Locker <dhlocker@...>
> > > 
> > > >
> > > >
> > > > I have no personal experience. I think a plated-through-holes
> (PTH) process
> > > > is usually a bit beyond the hobbyist level, but is the only way
> of achieving
> > > > no-bulge vias. All other methods (eyelets, fine-gauge wire)
> leave
> > > > protrusions on the surface that prevent flat mounting of
> components.
> > > >
> > > > It _might_ be possible to put down a pad with a slot in the
> copper
> > > > (extending radially from the hole) just wide enough to lay a
> fine gauge wire
> > > > in and bridge the pad's slot and the wire with solder, producing
> a
> > > > nearly-flat surface, but I wouldn't want to do many of those.
> Never mind.
> > > > 1oz copper is about 0.0013 inches thick, while 30AWG wire is
> 0.010 inch
> > > > diameter - that's about a 0.009 inch ridge on the board.
> > > >
> > > > Donald.
> > > > --
> > > > *Plain Text* email -- it's an accessibility issue
> > > > () no proprietary attachments; no html mail
> > > > /\ ascii ribbon campaign - <www.asciiribbon.org>
> > > >
> > > >
> > > 
> > > [Non-text portions of this message have been removed]
> > > 
> > > 
> > 
> > 
> > 
> > [Non-text portions of this message have been removed]
> > 
> 
> 
> 
> 
> ------------------------------------
> 
> Be sure to visit the group home and check for new Links, Files, and
> Photos:
> http://groups.yahoo.com/group/Homebrew_PCBsYahoo! Groups Links
> 
> 
>

Re: [Homebrew_PCBs] Quimical VIAs

2010-12-16 by Donald H Locker

Hello, Simon.

I couldn't find a link or guess the location of the DIY page referenced at the bottom of your platepcb home page.  I did find the lpkf and Chinese links, but those were the only links on that page (looking at the source, too).

Donald.
--
*Plain Text* email -- it's an accessibility issue
()  no proprietary attachments; no html mail
/\  ascii ribbon campaign - <www.asciiribbon.org>
Show quoted textHide quoted text
----- Original Message -----

> From: "Simon Gornall" <simon.gornall@...>
> To: "Homebrew PCBs" <Homebrew_PCBs@yahoogroups.com>
> Sent: Wednesday, December 15, 2010 1:15:17 PM
> Subject: Re: [Homebrew_PCBs] Quimical VIAs
> 

[snip]

> 
> I was recently looking at plated-through-holes myself. I found the
> LPKF solution (circa $10k), or a Chinese PTH machine (circa $1400 +
> $500 shipping). The Chinese one is not a pulse-plating system, it's
> just a DC plating machine. 
> 
> So, I thought about how to DIY one of these. LPKF will sell the
> chemistry in small doses (it'll still cost you $300 or so I reckon,
> but that's "small" :), so that's not an issue. I'm busy with other
> projects (my reef tank started leaking, and I have to re-install
> everything. A 240-gallon fishtank takes a lot of time to set up
> properly :) at the moment, so it hasn't got very far, but I put up the
> design at http://platepcb.com/ 

[snip]

Re: [Homebrew_PCBs] Quimical VIAs

2010-12-16 by Simon Gornall

On 15 Dec 2010, at 16:47, Donald H Locker wrote:

> Hello, Simon.
> 
> I couldn't find a link or guess the location of the DIY page referenced at the bottom of your platepcb home page. I did find the lpkf and Chinese links, but those were the only links on that page (looking at the source, too).
> 
At the top of the page, there's a 'welcome' link (which is what you're reading), and a 'DIY' link (which jumps to a blog-style page).

Cheers
	Simon



[Non-text portions of this message have been removed]

Re: [Homebrew_PCBs] Quimical VIAs

2010-12-16 by Donald H Locker

Thank you Simon, I found it.  I had to enable javascript to see those bits.

I'm on my way!
Donald.
--
*Plain Text* email -- it's an accessibility issue
()  no proprietary attachments; no html mail
/\  ascii ribbon campaign - <www.asciiribbon.org>

----- Original Message -----
Show quoted textHide quoted text
> From: "Simon Gornall" <simon.gornall@...>
> To: "Homebrew PCBs" <Homebrew_PCBs@yahoogroups.com>
> Sent: Wednesday, December 15, 2010 7:48:48 PM
> Subject: Re: [Homebrew_PCBs] Quimical VIAs
> 
> On 15 Dec 2010, at 16:47, Donald H Locker wrote:
> 
> > Hello, Simon.
> > 
> > I couldn't find a link or guess the location of the DIY page
> referenced at the bottom of your platepcb home page. I did find the
> lpkf and Chinese links, but those were the only links on that page
> (looking at the source, too).
> > 
> At the top of the page, there's a 'welcome' link (which is what you're
> reading), and a 'DIY' link (which jumps to a blog-style page).
> 
> Cheers
> 	Simon
> 
> 
> 
> [Non-text portions of this message have been removed]
> 
> 
> 
> ------------------------------------
> 
> Be sure to visit the group home and check for new Links, Files, and
> Photos:
> http://groups.yahoo.com/group/Homebrew_PCBsYahoo! Groups Links
> 
> 
>

Re: [Homebrew_PCBs] Quimical VIAs

2010-12-16 by Simao Cardoso

Larry Battraw wrote:

> 
> This sounds very interesting since you've had actual experience using
> these types of chemistries. 

Experience only with comercial palladium just like the one Markus Zingg
bought. In a commercial machine for small runs during some months. With
horrific documentation.

> Posting the recipe
> for anything is always informative even if homebrew people can't
> always get the same ingredients needed. 

I have posted it before... I prefer to have my results before saying how
i managed to get the not easy to figure what are and where to get stuff.
For personal reasons it will take time.

> 
> Are you talking about covering a board with graphite powder and then
> drilling the holes, such that the powder falls in and coats the
> hole-walls as they are drilled? It's not clear exactly what is going
> on, as you also talk about "graphite chemistry". Please let us know a
> little bit more about how this is done.
> 


You are right, i re-read my previous email and my english is really bad
i didn't got to make myself understood. 
I was saying that you drill the pcb in a drill press normally, but under
the pcb exists graphite powder. The drill bit must enter deep in the
powder and let it spread on the hole surface upwards. 
I referred graphite chemistry in comparison with carbon black to express
how conductive it is, nothing else, not to use the chemistry based on
it.
Ohh and of course (i always skip the obvious parts) it must be copper
plated after such mechanical activation. Suppressor additive is not
difficult to source as pure chemical (i got enough for 830liters for
14eur IIRC), and it should really help on this.


> Thanks for the detail you've given on this. I figured using something
> like an H-bridge with MOSFETs would do it but it sounds like it's more
> involved if you have to use reverse voltages that are different than
> the positive plating voltage. Have you had any success doing this
> type of plating or has it not worked out very well? What are some of
> the problems you've run into?

You need big currents. Say 50 up to 100A in direct mode (3 times for
reverse) for a 200x300mm (~100inch) board. Such circuit isn't easy and i
never did anything similar... It seams an AC TIG welder... Other than
that is the required voltage for the reverse pulse no matter how many
hairs i pull off i just can't figure it out, it will be found by
testing.

Simao

Re: [Homebrew_PCBs] Quimical VIAs

2010-12-16 by Simao Cardoso

Simon Gornall wrote:

> 
> Oh, I'll easily admit I don't fully understand everything I need to
> know for this :) Yet :)
> 
And i admit that didn't look to what CAT4101 were.

> > 
> My understanding was that you tend to vary either current or voltage
> in the pulses (so a constant-voltage, varying current supply would be
> ok). The CAT4101 has a wide range of voltage over which it will work
> (2-24v), so I'm covered, as long as a constant supply level at varying
> current is ok.

You need fixed voltage limited current that varies with board size. The
most important is respect current densities. 

> Ok - I'd seen 2x rather than 3x, but ok. I was aware it ought to be
> different, that was why there are 15 CAT4101's in the forward
> direction and 30 of them in the reverse direction. I wasn't actually
> planning on running them at max output, and the current ought to be a
> function of the board area anyway, right ?

My mistake, 10 to 20 for time relation, 3 or more for current. Just
checked. You wont need more psu power on reverse. Such sort pulse can be
helped with capacitors. But i should only speak about current not power
since voltage is still unknown to me...

> Right - I was planning on using the 5v supply on an ATX PSU and see
> where that got me. If I get burning, I'll reduce the voltage/current.
> If I get nothing, I'll increase the voltage (dropping it from the 12v
> supply on the PSU down to 6, 8, 10 etc. using a simple voltage divider
> and big resistors) and see what I can do. It's a relatively small
> investment for me (apart from the chemistry from LPKF) because I have
> a lot of the stuff on-hand. I use CAT4101's in LED drivers, and I have
> a spare 50 or so of them lying around :)

That way you can simple use 3.3V output and a big tank where you adjust
distance between anodes and cathode. 

Simao

Re: [Homebrew_PCBs] Quimical VIAs

2010-12-16 by Simon Gornall

On 15 Dec 2010, at 16:57, Simao Cardoso wrote:
> 
> You need big currents. Say 50 up to 100A in direct mode (3 times for
> reverse) for a 200x300mm (~100inch) board. Such circuit isn't easy and i
> never did anything similar... It seams an AC TIG welder... Other than
> that is the required voltage for the reverse pulse no matter how many
> hairs i pull off i just can't figure it out, it will be found by
> testing.
> 

Do you have a reference for that current calculation, Simao ?

I was looking at http://www.thinktink.com/stack/volumes/volvi/copplate.htm and they are quoting much lower currents. I was only actually trying to get a 100x160mm area plated (it's the limit of my CAD licence) but even 200x300mm comes out way short of 50A

According to their formula,

	Current 	= [(200/25.4 * 300/25.4 * 2)/144] * 20
		 	=> 25.8A 

For my (100x160mm) setup, it would be:

	Current	= [(160/25.4 * 100/25.4 * 2)/144] * 20
			=> 6.9A

Now admittedly, this is for a DC plating environment, not a reverse-pulsed one, but my reading of the pulse-plating literature implied that pulse-plating *let* you increase the current (to get things done faster, which board-houses like). It didn't *require* you to increase the current. I could be wrong, of course :)

Cheers
	Simon



[Non-text portions of this message have been removed]

Re: Quimical VIAs

2010-12-16 by powermatic66

MG Chemicals sells a that includes chemicals to plate vias.   The
directions may be interesting too

http://www.mgchemicals.com/products/electroless.html
<http://www.mgchemicals.com/products/electroless.html>
Bob S




[Non-text portions of this message have been removed]

Re: [Homebrew_PCBs] Quimical VIAs

2010-12-16 by Simao Cardoso

Simon Gornall wrote:

> 
> Do you have a reference for that current calculation, Simao ?

> Now admittedly, this is for a DC plating environment, not a
> reverse-pulsed one, but my reading of the pulse-plating literature
> implied that pulse-plating *let* you increase the current (to get
> things done faster, which board-houses like). It didn't *require* you
> to increase the current. I could be wrong, of course :)

No. Just current densities i saw at various patents and papers. Like for
DC 1A per dm.sq max for chemistries without additives 75min time. Or
3A/dm.sq with additives and true phosphoric anodes 25min. Time also
depends on the copper thick you wish, these are for 25micrometer or 1mil
deposit IIRC.

Your 144 is 12x12 inch on a square foot and you must be using ASF values
(amps per square foot) for the current density. There are ~9.3dm.sq in a
foot.sq, so 20asf are ~2.1A/dm�, thats a nice value for DC, 35minutes is
fast enough, but it should fall in the need-additives-category... 

The patents and papers i follow for this chemistry say 4 to 6 A/dm.sq
direct pulse. With 100A i could burn 200x300mm (~100in.sq) boards dark
brown at 8.3A/dm.sq or 77.2asf on 10minutes for 1mil deposit :D 
(if reverse pulses could replace additives) 

My desire with this setup is to reach the 3A/dm.sq and 25~30 minutes and
avoid additives (the anodes aren't copper) and i wont mind to go slower.
I bought 5V 50A psu's, by design i can have one psu per anode (or just
one) with total of 100A max possible...  For reverse i hope to only need
one psu but the design is capable to use 2 psu's for reverse pulse too.
So it's 48 to 72A according to the documentation (36A for my desire),
being oversized means room for tests  and the cheap psu's, won't get too
hot, no other reason for the 100A value.

Re: [Homebrew_PCBs] Quimical VIAs

2010-12-16 by Hugo Ferreira

Hi.
"Quimica" is the portuguese word for "Chemistry".
"Quimical" is a typo from a portuguese speaking person trying to say
"Chemical". =:-)
Only because they sound exactly the same.

Always glad to ear from you,
Warm Regards,
Hugo Ferreira
Portugal

2010/12/15 Simon Gornall <simon.gornall@...>:
Show quoted textHide quoted text
>
> (BTW: What on earth does 'quimical' mean ?)
>

Re: [Homebrew_PCBs] Quimical VIAs

2010-12-16 by Simon Gornall

On 16 Dec 2010, at 00:10, Simao Cardoso wrote:

> Simon Gornall wrote:
> 
> > 
> > Do you have a reference for that current calculation, Simao ?
> 
> > Now admittedly, this is for a DC plating environment, not a
> > reverse-pulsed one, but my reading of the pulse-plating literature
> > implied that pulse-plating *let* you increase the current (to get
> > things done faster, which board-houses like). It didn't *require* you
> > to increase the current. I could be wrong, of course :)
> 
> No. Just current densities i saw at various patents and papers. Like for
> DC 1A per dm.sq max for chemistries without additives 75min time. Or
> 3A/dm.sq with additives and true phosphoric anodes 25min. Time also
> depends on the copper thick you wish, these are for 25micrometer or 1mil
> deposit IIRC.
> 
> Your 144 is 12x12 inch on a square foot and you must be using ASF values
> (amps per square foot) for the current density. There are ~9.3dm.sq in a
> foot.sq, so 20asf are ~2.1A/dm², thats a nice value for DC, 35minutes is
> fast enough, but it should fall in the need-additives-category... 
> 
> The patents and papers i follow for this chemistry say 4 to 6 A/dm.sq
> direct pulse. With 100A i could burn 200x300mm (~100in.sq) boards dark
> brown at 8.3A/dm.sq or 77.2asf on 10minutes for 1mil deposit :D 
> (if reverse pulses could replace additives) 
> 
Ok, so if I'm only planning on being able to plate a 160x100mm board, or 1.6dm^2, using your figures that comes to a range of 6.4A -> 9.6A in the forward direction, and 19.2A->28.8A in the reverse direction. That's still (just) within the design I have, although I might add a few more CAT4101's in the reverse direction. I'd prefer to run them at 700mA each max rather than 1A.

Simon

[Non-text portions of this message have been removed]

Re: [Homebrew_PCBs] Quimical VIAs

2010-12-17 by Simao Cardoso

Simon Gornall wrote: 
> 
> Ok, so if I'm only planning on being able to plate a 160x100mm board,
> or 1.6dm^2, using your figures that comes to a range of 6.4A -> 9.6A
> in the forward direction, and 19.2A->28.8A in the reverse direction.


Simon, it depends on your chemistry and anodes. Get documentation and
follow it, i don't know what are you using but am sure my setup is way
different than yours. A quick search for values using copper anodes gave
3 to 4A dm� direct 10ms and 8 to 9A reverse 0.5ms but with phosphoric
copper anodes and additives, can you get these?? If not forget reverse
pulses, if yes you can go with DC, and no need to waste money with
reverse pulse driver. I opt for reverse pulses after find a complex to
build way to avoid buying copper anodes and maybe additives, trying to
spend money wiser not for having everything possible. 
Avoiding phosphoric copper anodes, additives and reverse pulses is what
started this thread and is what people want, such method exist and i
should go with it too. To avoid activation chemistries i tried to
describe a possible mechanical way to go, but i don't know results.

Ohh and i just realize that i misused suppressor word by the 100th time,
(i confuse it with leveler all the time) and bought the additive i
wasn't looking for, also i have plenty posts with this incorrect (and
other things...). Please accept my apologies. 

Simao

Re: [Homebrew_PCBs] Quimical VIAs

2010-12-17 by Vicent Colomar Prats

Hi all, and thank you all for your very interesting answers.

As Simao very well appointed, I'm Spanish speaker, and my English is not
very good (as you can observe), the correct word would be "Chemical" and not
"Quimical". Sorry me for that silly mistake, I did not use a translator.

My knowledge in chemicals is very, very poor. So I'm reading this thread
very carefully trying to understand all different options and information
you exposed. I liked Simon proposal, it looks not so complicated, I will
follow how it develops as Simao explains how the whole process depends on
some more factors.

I also like the simplicity of the proposal of DJ Delorie. I will give it a
try, it loos very simple, cheap and easy to do (something a hobbyer likes).


[Non-text portions of this message have been removed]

Re: [Homebrew_PCBs] Chemical VIAs

2010-12-28 by Simao Cardoso

Simon Gornall wrote:
> The SSR's will arrive in January next year, so perhaps I'll have a
> chance to work on it then.
> Apart from the chemistry, you're still looking at the high-hundreds
> for a reverse-pulse-plating machine if you DIY it. I can't see the
> price being much more "affordable" than that if it's sold
> commercially.

Hi, Which SSR's are you using? Can they do 0.5ms pulses? Or operate at
1V or less? The turn on time and the minimum voltage to operate seems
out off necessary range. Most the datasheets i shaw for 10-50A DC SSR's
had 10ms maximum turn on time, and 3V minimum required voltage to
operate. There was some at sub-0.5ms turn on but for 1A or so. Just
wondering did you checked if the SSR's you ordered fit the purpose?

Pulse plating documentation refers the value of a good square wave so
fast turn on/off is recommended. Mine idea of a plating driver was
started by a crazy wish of a electronically regenerated etchant, was to
test chemistries than could fit this desire, were very high current
densities define the efficiency. Fitting both purposes became not so
simple.
But any person with it's feet on the ground would just need 2 MOSFETs, 2
PSUs, a dual driver and a MCU with PWM to archive it. STP80NF55 (one for
direct other for reverse) and any dual 10V 2A driver gives you around
100ns for less money than one SSR.



It helps me some brainstorm-loud-thinking to set some ideas from
questions raised on this old thread, so...

Trying to understand the copper plating required voltage: Half Cell
potential for copper is +0.34V, if i understand the thing right, using
both copper anode and cathode there is no minimum required potencial for
deposition. According to graphics from cyclic voltametric stripping
(CVS) tests used to mesure additive behavior/content, copper start
plating right at 0.0V+, it start increasing faster at 0.2~0.3V and this
curve can be slower according to additives use. The current increase up
to a standing current point, that stands until the water electrolysis
voltage. 
I don't really remember the precise value on the bath i had access to,
was something about 2V in the power supply voltmeter. But wires,
connections and resistive titanium holders will always increase this
value on the power supply stage. Before i tried to get a simple answer
to this so i could choose PSU voltage, and got ~0.7 minimum 3V best, and
was wrong, i don't find any such reference in any documentation now, and
a 5V PSU may only fit if enough resistance exists between PSU and
plating cell , or by adding one power resistor in the circuit.
Finding water electrolysis voltage value is not easy without having good
chemistry skills, i think it's 1.23V, but in a sulfuric bath should be
2.05V but don't know for sure.
According to real descriptions shared on this discussion group: One
platter and is bought palladium chemistry and additives, say 0.6V for
plating voltage. He describes for PSU a 5V toroidal transformer and a
light dimmer on AC side for regulation. He later added series rectifier
diodes on the DC side to increase the minimum voltage about 3V so the
light dimmer work as useful controller. Other platter with is fully
homebrew carbon black chemistry describes using a 5V output from an ATX
PSU with steel wire as power resistor, using  a alligator clip to choose
desired current position. He reports 0.7V on the bath 1.6V at PSU with
macdermind brightener.
Seems to be possible to conclude that plating will occur under 1V and
with total connections and wires resistance should be required 2~3V on
the PSU. The use of one 5V PSU and a resistor can help the current
control. 

ATX PSUs are a easy choice. I would also wish that adjustable voltage
and current could be done for cheap at the PSU directly. I learned that
some PSUs from meanwell use DC side simple PWM controllers, with a
current sensor. On such, a resistor replacement by pots would be enough
to slightly vary voltage/current. One attempt on a 5V 25A PSU didn't
fully work, (but at least didn't ended in smoke like other times i tried
to hack switched mode PSUs :D) IIRC i made the thing going down from 5V
to 2.5V as expected but only goes back up to 3V... I couldn't test the
current control because with a 20A multimeter directly connected, the
PSU don't even power on, and trying with a steel welding rod as a 1ohm
power resistor it didn't turn on either. I have to get something for
test load, and the voltage modification isn't convenient done, at the
store they didn't had the needed potentiometer values and i ended
modifying other resistor values to fit. I have to try again. 

About the pcb plating, there are plenty people in this group which do it
themselves (either by commercial/homebrew machines/chemistries), none of
them, by what was shared, seem to bother with reverse pulses. It's an
obvious good thing, but not an simpler/complete solution. 
Currents and pulse times vary with chemistries, and such vary with
desired throwing power and aspect ratios. You can find very
different&confusing copper/acid ratios between chemistries; high aspect
ratio tend to have more acid and less copper; faster high current
densities have more copper and less acid; reverse pulse chemistries
prefer less acid more copper and highly suppressing current additives
(bigger potencial variance for current adjust). 
Using additives can be PITA in medium term for a non chemistry knowledge
guy, like i have experienced. Worst, if using this less often you end
not having all the technical stuff present in your mind, ending in
mistakes and boring repeated readings, like myself.
I would like to replace leveler with reverse pulses and brightener with
filtration for my use, but further reading tells me its not quit as
first thought, if it works will be like lottery. There is a supplier
that promotes additives free, reverse pulse plating chemistry, but their
patents don't disclosure much... except it don't use brightener or lever
but use catalyst and suppressor (which are not consumed like leveler and
brightener and are considered initial setup).

Catalyst and suppressor additives are simple chemicals that i got, other
3 organic compounds used as leveler can afterall be found as dye or pH
indicator in pure chemical too, but its useless without brightener
(Cl-PEG-SPS based system). Brightener is impossible to get as pure
chemical in low quantities, only from plating supplies as a set. But for
both leveler and brightener were once used thiourea (i also have it)
with the downside of lowering plated copper conductivity.
In the day i finally manage to get all the chemicals for the activation
chemistry i most probably will use a very simple DC plating setup. Too
much variables is a bad start. 

About the graphite drilling activation, i managed to find a old post
from the same author of
drilling-above-graphite-powder-mechanical-activation about his success
rate, were he says better than 1:200 hole failure rate! (but with
previous descriptions of 50% failure on <0.6mm holes and a initial
success report of 10% failure rates with 1mm holes). So considering
0.8mm vias and a learning curve seems a fair good system.

I also managed to find a number for the carbon black bath life. Graphite
chemistry can reach one day life, it suffers from CO2 absorption. Carbon
black as a problem of losing (???) oxygen, but i never saw bath life
quantified. The person says that expect 1-2 years life with his homebrew
chemistry. I was guessing much less, and am still curious about how the
real life ended to be... 

About palladium and carbon black. The plating machine i had access to,
had quiet some history about misuse of the chemistry. Loosing the
palladium bath by drag-on from previous bath because insufficient
rising, plated copper peeling off because not yet hot salt remover use,
and so. Not only is a bit sensitive but one have to use it rigorously.
And people tend to make mistakes with it, i was told that similar
machines were without use because owners ended spending more money with
it that if ordering the PCBs from a boardhouse. 
Besides the drying and repeat steps of a carbon black chemistry, if one
could mix it from things possible to dump without worrying about money
spent or environmental issues, if one damage it, it's always easy to
start over.

Good year,
Simao

Re: [Homebrew_PCBs] Chemical VIAs

2010-12-28 by Simon Gornall

On 27 Dec 2010, at 17:22, Simao Cardoso wrote:

> 
> Simon Gornall wrote:
> > The SSR's will arrive in January next year, so perhaps I'll have a
> > chance to work on it then.
> > Apart from the chemistry, you're still looking at the high-hundreds
> > for a reverse-pulse-plating machine if you DIY it. I can't see the
> > price being much more "affordable" than that if it's sold
> > commercially.
> 
> Hi, Which SSR's are you using? Can they do 0.5ms pulses? Or operate at
> 1V or less? The turn on time and the minimum voltage to operate seems
> out off necessary range. Most the datasheets i shaw for 10-50A DC SSR's
> had 10ms maximum turn on time, and 3V minimum required voltage to
> operate. There was some at sub-0.5ms turn on but for 1A or so. Just
> wondering did you checked if the SSR's you ordered fit the purpose?
> 
Yes, I checked :)

The ones I ordered were http://www.futurlec.com/Relays/SSRDC50V80A.shtml - these are "cheap" ($28 each) and can switch on/off within 0.5ms. I've never seen an SSR with a minimum load voltage - they have minimum control voltages but 3v is pretty ideal for that, considering it'll be driven by a microcontroller. Technically, I suppose it takes 0.5ms for the switch-on and another 0.5ms for the switch-off, but I'm guessing there's a wave-function on both on/off, so the time that the pulse is actually 'on' will be ~0.5ms, where 'on' is defined as > 0.5 x peak pulse voltage.

If it turns out that the pulses aren't good enough (0.5ms is pretty much at the limit of these devices), the ones I initially saw can do 20kHz (0.05ms) but these are more expensive ($63 each). 

> 
> Pulse plating documentation refers the value of a good square wave so
> fast turn on/off is recommended. Mine idea of a plating driver was
> started by a crazy wish of a electronically regenerated etchant, was to
> test chemistries than could fit this desire, were very high current
> densities define the efficiency. Fitting both purposes became not so
> simple.
> But any person with it's feet on the ground would just need 2 MOSFETs, 2
> PSUs, a dual driver and a MCU with PWM to archive it. STP80NF55 (one for
> direct other for reverse) and any dual 10V 2A driver gives you around
> 100ns for less money than one SSR.
> 
I guess my feet are up in the air then :) I'm far more comfortable in the digital electronics world than the discrete components sphere. What I know about MOSFETs can be written down on the back of a postage stamp :)

I was using SSRs to isolate the two circuits, and make sure there was no current flowing between them (since both anode and cathode are connected to + and - on different PSU circuits).If MOSFETs can do that, cool :)

Simon



[Non-text portions of this message have been removed]

Re: Chemical VIAs

2010-12-29 by psykhon@yahoo.com

@Simao:
       Could you please post the links regarding homebrew black hole formulas? I haven't found it using the search engine here or googling. 
Regards

--- In Homebrew_PCBs@yahoogroups.com, Simao Cardoso <simaocardoso@...> wrote:
Show quoted textHide quoted text
>
> 
> Simon Gornall wrote:
> > The SSR's will arrive in January next year, so perhaps I'll have a
> > chance to work on it then.
> > Apart from the chemistry, you're still looking at the high-hundreds
> > for a reverse-pulse-plating machine if you DIY it. I can't see the
> > price being much more "affordable" than that if it's sold
> > commercially.
> 
> Hi, Which SSR's are you using? Can they do 0.5ms pulses? Or operate at
> 1V or less? The turn on time and the minimum voltage to operate seems
> out off necessary range. Most the datasheets i shaw for 10-50A DC SSR's
> had 10ms maximum turn on time, and 3V minimum required voltage to
> operate. There was some at sub-0.5ms turn on but for 1A or so. Just
> wondering did you checked if the SSR's you ordered fit the purpose?
> 
> Pulse plating documentation refers the value of a good square wave so
> fast turn on/off is recommended. Mine idea of a plating driver was
> started by a crazy wish of a electronically regenerated etchant, was to
> test chemistries than could fit this desire, were very high current
> densities define the efficiency. Fitting both purposes became not so
> simple.
> But any person with it's feet on the ground would just need 2 MOSFETs, 2
> PSUs, a dual driver and a MCU with PWM to archive it. STP80NF55 (one for
> direct other for reverse) and any dual 10V 2A driver gives you around
> 100ns for less money than one SSR.
> 
> 
> 
> It helps me some brainstorm-loud-thinking to set some ideas from
> questions raised on this old thread, so...
> 
> Trying to understand the copper plating required voltage: Half Cell
> potential for copper is +0.34V, if i understand the thing right, using
> both copper anode and cathode there is no minimum required potencial for
> deposition. According to graphics from cyclic voltametric stripping
> (CVS) tests used to mesure additive behavior/content, copper start
> plating right at 0.0V+, it start increasing faster at 0.2~0.3V and this
> curve can be slower according to additives use. The current increase up
> to a standing current point, that stands until the water electrolysis
> voltage. 
> I don't really remember the precise value on the bath i had access to,
> was something about 2V in the power supply voltmeter. But wires,
> connections and resistive titanium holders will always increase this
> value on the power supply stage. Before i tried to get a simple answer
> to this so i could choose PSU voltage, and got ~0.7 minimum 3V best, and
> was wrong, i don't find any such reference in any documentation now, and
> a 5V PSU may only fit if enough resistance exists between PSU and
> plating cell , or by adding one power resistor in the circuit.
> Finding water electrolysis voltage value is not easy without having good
> chemistry skills, i think it's 1.23V, but in a sulfuric bath should be
> 2.05V but don't know for sure.
> According to real descriptions shared on this discussion group: One
> platter and is bought palladium chemistry and additives, say 0.6V for
> plating voltage. He describes for PSU a 5V toroidal transformer and a
> light dimmer on AC side for regulation. He later added series rectifier
> diodes on the DC side to increase the minimum voltage about 3V so the
> light dimmer work as useful controller. Other platter with is fully
> homebrew carbon black chemistry describes using a 5V output from an ATX
> PSU with steel wire as power resistor, using  a alligator clip to choose
> desired current position. He reports 0.7V on the bath 1.6V at PSU with
> macdermind brightener.
> Seems to be possible to conclude that plating will occur under 1V and
> with total connections and wires resistance should be required 2~3V on
> the PSU. The use of one 5V PSU and a resistor can help the current
> control. 
> 
> ATX PSUs are a easy choice. I would also wish that adjustable voltage
> and current could be done for cheap at the PSU directly. I learned that
> some PSUs from meanwell use DC side simple PWM controllers, with a
> current sensor. On such, a resistor replacement by pots would be enough
> to slightly vary voltage/current. One attempt on a 5V 25A PSU didn't
> fully work, (but at least didn't ended in smoke like other times i tried
> to hack switched mode PSUs :D) IIRC i made the thing going down from 5V
> to 2.5V as expected but only goes back up to 3V... I couldn't test the
> current control because with a 20A multimeter directly connected, the
> PSU don't even power on, and trying with a steel welding rod as a 1ohm
> power resistor it didn't turn on either. I have to get something for
> test load, and the voltage modification isn't convenient done, at the
> store they didn't had the needed potentiometer values and i ended
> modifying other resistor values to fit. I have to try again. 
> 
> About the pcb plating, there are plenty people in this group which do it
> themselves (either by commercial/homebrew machines/chemistries), none of
> them, by what was shared, seem to bother with reverse pulses. It's an
> obvious good thing, but not an simpler/complete solution. 
> Currents and pulse times vary with chemistries, and such vary with
> desired throwing power and aspect ratios. You can find very
> different&confusing copper/acid ratios between chemistries; high aspect
> ratio tend to have more acid and less copper; faster high current
> densities have more copper and less acid; reverse pulse chemistries
> prefer less acid more copper and highly suppressing current additives
> (bigger potencial variance for current adjust). 
> Using additives can be PITA in medium term for a non chemistry knowledge
> guy, like i have experienced. Worst, if using this less often you end
> not having all the technical stuff present in your mind, ending in
> mistakes and boring repeated readings, like myself.
> I would like to replace leveler with reverse pulses and brightener with
> filtration for my use, but further reading tells me its not quit as
> first thought, if it works will be like lottery. There is a supplier
> that promotes additives free, reverse pulse plating chemistry, but their
> patents don't disclosure much... except it don't use brightener or lever
> but use catalyst and suppressor (which are not consumed like leveler and
> brightener and are considered initial setup).
> 
> Catalyst and suppressor additives are simple chemicals that i got, other
> 3 organic compounds used as leveler can afterall be found as dye or pH
> indicator in pure chemical too, but its useless without brightener
> (Cl-PEG-SPS based system). Brightener is impossible to get as pure
> chemical in low quantities, only from plating supplies as a set. But for
> both leveler and brightener were once used thiourea (i also have it)
> with the downside of lowering plated copper conductivity.
> In the day i finally manage to get all the chemicals for the activation
> chemistry i most probably will use a very simple DC plating setup. Too
> much variables is a bad start. 
> 
> About the graphite drilling activation, i managed to find a old post
> from the same author of
> drilling-above-graphite-powder-mechanical-activation about his success
> rate, were he says better than 1:200 hole failure rate! (but with
> previous descriptions of 50% failure on <0.6mm holes and a initial
> success report of 10% failure rates with 1mm holes). So considering
> 0.8mm vias and a learning curve seems a fair good system.
> 
> I also managed to find a number for the carbon black bath life. Graphite
> chemistry can reach one day life, it suffers from CO2 absorption. Carbon
> black as a problem of losing (???) oxygen, but i never saw bath life
> quantified. The person says that expect 1-2 years life with his homebrew
> chemistry. I was guessing much less, and am still curious about how the
> real life ended to be... 
> 
> About palladium and carbon black. The plating machine i had access to,
> had quiet some history about misuse of the chemistry. Loosing the
> palladium bath by drag-on from previous bath because insufficient
> rising, plated copper peeling off because not yet hot salt remover use,
> and so. Not only is a bit sensitive but one have to use it rigorously.
> And people tend to make mistakes with it, i was told that similar
> machines were without use because owners ended spending more money with
> it that if ordering the PCBs from a boardhouse. 
> Besides the drying and repeat steps of a carbon black chemistry, if one
> could mix it from things possible to dump without worrying about money
> spent or environmental issues, if one damage it, it's always easy to
> start over.
> 
> Good year,
> Simao
>

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