DaveC <davec2468@...> writes: > I'm confused: you use LESS hcl and the reaction was faster? I thought > the acid is what increased (using more) or decreased (using less) the > speed of the reaction, no? Reactions run fastest when all the parts needed are present in sufficient quantities. Pure HCl will *not* etch copper! You also need an oxidant! (amusingly enough, pure HCL *will* take the tarnish off copper, as the tarnish is pre-oxidized copper) The H2O2 provides an oxidant, so you need enough of that also. In a CuCl etchant, the CuCl is itself an oxidizer and acid, but you still need HCl to provide additional Cl atoms for it to work.
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Re: [Homebrew_PCBs] Re: Sponge etching with HCl and H2O2?
2011-11-28 by DJ Delorie