--- In
Homebrew_PCBs@yahoogroups.com, "Phil" <phil1960us@y...> wrote:
>
> --- In Homebrew_PCBs@yahoogroups.com, "Stefan Trethan"
> <stefan_trethan@g...> wrote:
> ...
> > Interesting too. But if you need interection between top/bottom i
> prefer
> > using components over
> > making separate vias - kind of defeats the purpose.
> > You can simply rotate the second row around (and slide, clip) to
> solder it
> > flat on the top layer, or
> > use two single row butt-to-butt.
>
> The problem with dual row right angle is one row is shorter than the
> other so cliping is needed (as you say). Others may have better
> skills than I...
>
> I agree that if I have to make a lot of vias, might as well do TH.
> However, if its only a couple, vias are preferable.
>
> By the way, I did a destructive test on the header I tried out.
Its
> a stronger connection than TH. I broke it off but pieces of FR4
came
> with it! Its all about surface area.
Surface area and board material !
When I got my T-TEch machine, it came with a couple sheets of 1oz dbl
sided with a very white substrate. the copper pealed off very
easily. So easy that it was easier to peal than to use the cutter
to clear large sections of unused area.
The FR-4 I used next was next to impossible to peal and the CM-1 I
now use is very easy compared to FR4 but not quite as easy as the
other stuff.
Dave