--- In
Homebrew_PCBs@yahoogroups.com, Adam Seychell <a_seychell@y...>
wrote:
> Thats not the full story, the regeneration reaction consumes both
oxygen
> (from air) and free hydrochloric acid. Overall it is;
>
> CuCl + O + 2HCl -> CuCl2 + H20
This doesn't balance. where does the other Cl go?
But the reaosn for my post is a question about this process. I can
bubble for 48+ hrs and get slow etching ( about 1 hr) but if I add 50
mL of 35% H2O2 (2.5 L of etchant) it takes about 1/3 the time. Acid
level look right and SG is getting towards 1.17. I think there must
be some other reaction taking place - any one able to shed light on this?
Phil