> I know that approach, but it leads to a lot of vias, which i don't
>want tosolder.
> Also it seems to work better with throughhole and less good with
>hybrid boards.
When you send it for manufacturing the vias are no problem.
Actually I've heard that more vias is preferred before less, since the
forces in vias during tempurature changes can break the via.
For the Midnight Board Maker each via represent a problem so the less
the merrier...
Gunnar Lestander
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Gunnar Lestander
�nglyckan
694 93 �stansj�
mailto:
sm4vlm@...hem 0582 526 93
mob 073 96 93 916
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