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The paper kinda, sorta, gets around to mentioning silvermigration at the very end. The is a very important failuremechanism for silver plated traces that have a DC voltagedifference between them. The paper mentions that this occurs underspecific conditions, but does not say what those conditions are.The conditions are easily met. A small potential differencebetween the conductors, and moisture. A film of water is notnecessary, but just plain humidity. If you want to see this verydramatically, and quickly, put 5 volts between two silver platedconductors and bridge them with a drop of water. Watch under about10X magnification. A fern like (dendritic) structure will grow outfrom the negative side toward the positive trace. If you don'tlimit the current, the the dendritic structure will "explode" whenit hits the positive trace. If you limit the current enough, theshort will be permanent, even after the water evaporates.
A good description is available here:
I posted a file RE silver vs gold plating for contacts. I probably shouldn't take up file space for this so i willdelete the file and just supply the link.
ThePerformance Implications of Silver as a Contact ... - TEConnectivity
Mike N.