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Subject: Re: [Homebrew_PCBs] Adapting solder resist application to TT method

From: Harvey White <madyn@...>
Date: 2014-10-10

On 09 Oct 2014 14:20:09 -0700, you wrote:

>I ran across a couple of youtube videos showing a 3-ply green film being applied to a board to make the solder resist layer:
>
>http://www.youtube.com/watch?v=y_LJ1W3DolM
>
>http://www.youtube.com/watch?v=B0Syj4awcc8
>
>I use the toner transfer method to etch 0.0625" thick copper boards.
>Am wondering if I could use this stuff on my boards if I am not set up for photoetching.

This is most likely a UV cure film that's photosensitive, and needs to
be developed. You laminate it on, expose it, develop it to get the
unwanted parts off, then likely bake it to cure it.
>
>Does anybody know if (1) this 3-ply green film is sold in the USA and if yes, what it is called and by whom?
>
I do toner transfer as well, but no, I don't.

>(2) Can I still use this stuff on my boards if I am doing TT rather than photo-etching for laying out my pads/traces? If yes, how ?

Nope, not a chance as I understand it. If you did laminate your
board, how are you planning to get the little holes in it for the
pads? If you cure the film, then if it covers everything and resists
solder, then that doesn't help, not that I can see.

If you were to use the green laminate film specifically designed to
strengthen the toner on a PC board, then you'd need a layer of toner
that completely covered the board except for the pads, and that toner
and green layer would have to be solder heat resistant (never tried to
see if it is).

If someone has done this, I'd be interested in how, and using what
materials.....

Harvey

>
>If I am going down the wrong path, please say so.
>
>Thanks,
>
>Allan