Silver and Cooper powder or flask with solder mask a the adhesive/aglutinant
Both sides should be laminated with something "peelable" prior to drilling
Lots of testing to find the right proportions,but I guess more than 90% metals
--- In Homebrew_PCBs@yahoogroups.com, "cheater00 ." <cheater00@...> wrote:
>
> On Tue, Feb 11, 2014 at 1:56 AM, Paul Alciatore <palciatore@...> wrote:
> >
> > I wonder if adding some powdered metal that does not melt at
> > soldering temperatures to the solder paste would help it to coat the
> > walls of the via. It may be a question of finding the right alloy and
> > the right particle size. You may need different sized particles for
> > different size vias.
>
> Interesting. What's your reasoning why that would help?
>
> Cheers,
> D.
>