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Subject: RE: Re: [Homebrew_PCBs] Question about dry film negative photoresist...

From: <twgray2007@...>
Date: 2013-09-05

No, I don't leave the developer on the board after developing.  The last stage of developing is rinsing in cool water to wash the unexposed areas of the film off.  The dry film I am using clearly suggests letting the board dry after developing, preferably  overnight.


One possible problem is that I only put the board through the laminator one time, rather than several passes, so it may not be bonding as well as it should.


Thanks for the info.


At any rate, I am going to give it another go today



--- In Homebrew_PCBs@yahoogroups.com, <homebrew_pcbs@yahoogroups.com> wrote:

The points I gave still apply, they are the reasons for easy to remove resist. 

Although I wonder if you may be doing something a bit weird, no need to "let the board dry overnight", if you're leaving it wet with developer, that would be a problem ("developer" works as a stripper too, given time), rinse with water and dry it off with a paper towel as soon as you have developed it.

To give you an idea...

Clean blank PCB: 3 minutes
Attach film: 5 minutes
Dark Rest: until cooled (5-10 minutes)
Setup for exposure: 3 - 5 minutes
Expose: 2.5 minutes
Dark Rest: 3 - 5 minutes (if you bother, I don't)
Develop: 2 - 5 minutes in 20g/L warm Sodium Carbonate solution
Etch: depends on etchant
Strip: 10 minutes - 30 minutes in hot strong Sodium Carbonate solution

from a dirty blank PCB, to an etched board ready to drill, it takes about an hour including messing around with artwork etc...




On 05/09/13 13:30, twgray2007@... wrote:
 

No, after developing and letting the board dry...usually overnight...the resist just flakes off in some spots.Â