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Subject: Question about dry film negative photoresist...

From: <twgray2007@...>
Date: 2013-09-04

I recently purchased some of the some of the dry film negative photoresist sheets from: 

http://www.digole.com/index.php?productID=228

and am experiencing a problem.  The film exposes and develops exactly as advertised...extremely easy to use...but I am having a problem after develping.  The film remaining on the board seems flake off in some spots.  Is this a product of over-developing?  Or, maybe the boards aren't completely dry before laminating the film to the pcb?  I suspected this was the problem but then I read somewhere that some people recommend laminating the film to a wet pcb to avoid bubbles.

Any ideas?

I also have a problem where every third or forth attempt to laminate the film to the board it crinkles in spots for no apparent reason, but that is another subject altogether.