--- In
Homebrew_PCBs@yahoogroups.com, DJ Delorie <dj@...> wrote:
>
>
> I use a small air bubbler to regenerate, seems to work just fine for me.
> I turn on the air at the start of the process, so it's running for an
> hour or so before I etch.
Part of the trick is to maximize the area of interaction, which
means that a LOT of tiny bubbles are better than big bubbles.
Thus, think of the design of the nozzle that blows air into the
solution.
I wonder if cooling the solution would help, since cooled solutions can usually absorb more air than warm solutions?
Would pressurizing the system help? If it could be taken up to a few
atmospheres of pressure, would that help the Oxygen dissolve into the
solution? (Don't blow up the container!)
What about mechanical agitation of the solution? Would sealing the container and placing it on a shaker work?
Dave