Hi Donald,
I think your idea of putting a thin wire in a slotted pad could work, but it
is going to be a lot of work. A friend of mine also tried to flat the vias
(normal ones with a simple piece of wire) with a dremel and did a good job.
It is also a lot of work but never did it enought to put an IC on top of
those vias.
Another idea I have, but not tried yet, is with sodder paste. First try one
side, then the other. Or maybe helped with a very thin wire in the hole?
Anybody tried something similar?
Anyway, some of this "inventions" can work with more o less result, but I'm
convinced the way is to go to a quimical or electrolytical plated process.
Is there anything affordable for the hobbyier?
2010/12/15 Donald H Locker <
dhlocker@...>
>
>
> I have no personal experience. I think a plated-through-holes (PTH) process
> is usually a bit beyond the hobbyist level, but is the only way of achieving
> no-bulge vias. All other methods (eyelets, fine-gauge wire) leave
> protrusions on the surface that prevent flat mounting of components.
>
> It _might_ be possible to put down a pad with a slot in the copper
> (extending radially from the hole) just wide enough to lay a fine gauge wire
> in and bridge the pad's slot and the wire with solder, producing a
> nearly-flat surface, but I wouldn't want to do many of those. Never mind.
> 1oz copper is about 0.0013 inches thick, while 30AWG wire is 0.010 inch
> diameter - that's about a 0.009 inch ridge on the board.
>
> Donald.
> --
> ∗Plain Text∗ email -- it's an accessibility issue
> () no proprietary attachments; no html mail
> /\ ascii ribbon campaign - <www.asciiribbon.org>
>
>
[Non-text portions of this message have been removed]