Na 4.10.2010 12:39, Howard Chester je pisal:
>> From: "Steve Maroney"<steve@...>
>> To: "Homebrew PCBs"<Homebrew_PCBs@yahoogroups.com>
>> Sent: Friday, September 24, 2010 12:02:18 AM
>> Subject: [Homebrew_PCBs] Trouble with through hole pads connected to plane
>>
>> Dear Gang,
>>
> Re: [Homebrew_PCBs] Trouble with through hole pads connected to plane
>>
>> I'm having quite a bit of trouble when I solder a component lead (or
>> jumper wire) to a through-hole pad that is connected to a ground plane.
>> When I heat the component lead/pad and begin to apply solder, the solder
>> flows outwards over the plane around the pad but not to the lead and/or
>> pad itself. The more solder I continue to feed in just continues to
>> build up outside of the pad. Every now and then , I'll get a pad that
>> the solder will stay within, but most wont.
>>
>>
The problem is that ground plane isn't conected to trought hole as
thermal pads. ie the ground plane have only hole instead little hatch
patern around hole and BAD soldering TECHNIK or soldering IRON.
As you say that solder flows around I think the soldering technik is to
blame.
If you have screwdriver tip then hold soldering iron about at 60-70
degres (near vertical) and be shure to touch wire with more surface
contact as board and apply solder from opposite side. This should work.
If not then the temperature is to low. The key is to melt solder in wire
1'st and then quick put solder wire into juniction place.
If holes are plated then in oposite side the solder should have convex
shape not concave (if it's like blob then isnt ok) - Soldering iron to
cold or very bad solder.