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Subject: Re: Toaster oven reflow for SMT devices

From: "Dave Mucha" <dave_mucha@...>
Date: 2003-09-21

> you put the circuit in when it was already hot?
> but how to get it out not causing the parts to slide around (ok not
so much
> a problem with through hole....)


Not having any experiance with this method, from what I have read,
the surface tension of the solder and the chip will acutually pull
the chip into alignment with the center of the pad, trace, whatever.

Much like how solder will create a perfect curve around pins, the
strenght of the surface tension is pretty strong. Remember floating
a needle on water in science class ?

But, as was mentioned, movement, shaking and gravity can re-posistion
things PDQ !

Why not use an over thermometer and just unplug the oven and wait
until it cools enough to let the solder solidify ?


Dave