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Subject: Re: Flip n' Print ? (concept proposal for development)

From: "James" <jamesrsweet@...>
Date: 2010-05-21

--- In Homebrew_PCBs@yahoogroups.com, "Richard" <richard.liberatoscioli@...> wrote:
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> Hi James!
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> "....difficulty getting all the components lined up at exactly the same height...."
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> You lost me here ... all the SMD's lay in flat down against the flat surface of the substrate, easily keeping all the SMD's at the same level.
>


Oh I misread part of the process. I had thought you meant you would lay out the components upside down and pot them in epoxy up to the level of the leads and then print on top of that. Makes sense now, curious how this works out.