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Subject: Re: [Homebrew_PCBs] Dry film tenting problem & pattern plating

From: Simao Cardoso <simaocardoso@...>
Date: 2010-01-08

Volkan Sahin wrote:

>
> It seems peroxy-sulfuric etcher won't etch tin etch resist and it is
> possible to obtain stabilizer from think&tinker in low volume.



I don't know why Stefan Trethan says that, i also said lots of very
wrong things in here already, but is really bad when we induce people in
mistake.

The peroxy-sulfuric will etch tin without additives. The stabilizer is
for the 35% - 50% hydrogen peroxide don't decompose in explosion when
you put a copper board in there.

I also wish to use a sulfuric based etchant but not like this.
Did you read the patents i mentioned?