Please send these to me off-list.
Thanks,
Steve Greenfield
--- In Homebrew_PCBs@yahoogroups.com, Stefan Trethan <stefan_trethan@...> wrote:
>
> Steve can you please change drake@... to no email? It bounces every
> time for the last few days.
>
> ST
>
> On Sun, Sep 13, 2009 at 12:30 PM, Mail Delivery System <
> MAILER-DAEMON@...> wrote:
>
> > This is the mail system at host sgeorge.spng.org.ec.
> >
> > I'm sorry to have to inform you that your message could not
> > be delivered to one or more recipients. It's attached below.
> >
> > For further assistance, please send mail to postmaster.
> >
> > If you do so, please include this problem report. You can
> > delete your own text from the attached returned message.
> >
> > The mail system
> >
> > <drake@...>: cannot update mailbox /var/mail/drake for user drake.
> > error writing message: File too large
> >
> > Final-Recipient: rfc822; drake@...
> > Original-Recipient: rfc822;drake@... <rfc822%3Bdrake@...>
> > Action: failed
> > Status: 5.2.2
> > Diagnostic-Code: x-unix; input/output error
> >
> >
> > ---------- Forwarded message ----------
> > From: Stefan Trethan <stefan_trethan@...>
> > To: Homebrew_PCBs@yahoogroups.com
> > Date: Sun, 13 Sep 2009 12:35:06 +0200
> > Subject: Re: [Homebrew_PCBs] Re: developing immersion tank
> >
> >
> > But this is the step after developing, done with water, not developer.
> >
> > To me it seems the resist will turn into gunk in the developer even
> > without much agitation, and that gunk is washed away in the next step?
> >
> > ST
> >
> > On Sun, Sep 13, 2009 at 11:50 AM, Adam Seychell <a_seychell@...<a_seychell%40yahoo.com.au>>
> > wrote:
> >
> > >
> > > All the data sheets I've read have only mentioned developing with spray.
> > > In my experience the resist simply does not wash away with simple
> > > immersion or bubble agitation.
> > >
> > > From the data sheet http://www.dryfilmresist.com/pds/kg5100.pdf
> > >
> > > "To affectively clean between circuit traces to remove all developing
> > > residue, the panels must be throughly rinsed
> > > with water at temperatures ranging from 15 to 30â (59-86F) and pressures
> > > greater than 1.4 bar(20psi). Poor
> > > rinsing may promote ragged edges, rough plating, step plating, resist
> > > lifting. Rinsing is a most important part of
> > > the developing process."
> > >
> > > Adam
> > >
> >
> >
> >
> > Email secured by Check Point
> >
> >
> >
>
>
> [Non-text portions of this message have been removed]
>