nisma@... wrote:
>
>
> No, professional pcb maker use spray developing only for fine structures,
> 6mil and down, where 6mil can be done on immersion tank.
> The point is, that developing on spray method is critical, because
> it needs anti foam agent and the developer don´t last long.
> For 10mil and 8mil, the immersion tank is prefered, eventually 6mil
> with agitation (pump+filter, Co2, mecanical) too.
>
All the data sheets I've read have only mentioned developing with spray.
In my experience the resist simply does not wash away with simple
immersion or bubble agitation.
From the data sheet
http://www.dryfilmresist.com/pds/kg5100.pdf"To affectively clean between circuit traces to remove all developing
residue, the panels must be throughly rinsed
with water at temperatures ranging from 15 to 30℃ (59-86F) and pressures
greater than 1.4 bar(20psi). Poor
rinsing may promote ragged edges, rough plating, step plating, resist
lifting. Rinsing is a most important part of
the developing process."
Adam