I have used 30 gauge wire under components. My procedure is
1. Drill via holes just slightly larger than the wire size. I can not
remember which drill number it was. Ideally you want a little resistance
when inserting the wire.
2. Scotch tape the corners of the board. This elevates the board
a few thousands.
3. From the back side of the board insert wire into via so that it touches
the table underneath. It should protrude slightly above the surface.
because of step one.
4. Solder wire the board.
5. Cut wire.
6. Repeat for all holes.
7. Flip board over and apply flux and solder paste to wires.
8 Reflow solder in toaster oven.
9 Verify continuity and that components clear the vias.
--- In Homebrew_PCBs@yahoogroups.com, "Brian" <blue_eagle74@...> wrote:
>
> I have made double sided boards. I have tried 30 AWG wire, to big for putting under componets and flat wire from trace repair kits. The problem I am having is solder buildup. I have tried solder wicking but leaves less than desired amounts of solder. I have even used replacement eyelets but either they are too long or the pad area is to big and/or wide to put under componets.
>
> What have you used that works, besides through hole plating?
>
> Brian
>