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Subject: Re: [Homebrew_PCBs] Re: solder paste choice

From: DJ Delorie <dj@...>
Date: 2009-05-02

You folks aren't making this easy for me... ;-)

One thing I noticed about my current no-clean is that the residue has
(relatively) low resistance. If I have a 25 mil gap between power and
ground, an inch of that results in 330k between them. I end up
scraping between traces to get the hardened residue off.

I wonder if a waterpik would be enough to get those hard-to-reach
places that make people avoid water soluble flux? I do have some QFNs
in my current project...