Well, obviously experiences and opinions will vary as always.
Your method involving the two irons seems awfully complicated compared
to paste....
ST
On Sun, Feb 22, 2009 at 11:39 PM, Adam Seychell <a_seychell@...> wrote:
>
> Do you apply a continuous trail of solder paste along each row of pads
> of a quad plat pack IC ? If so you you use a syringe to apply the paste ?.
> I found it easier to just use solder wire and dragging the iron across.
> There are many videos on the net showing this method.
>
> For all small SMD parts (resistors, caps, transistors,...) I found
> trying to apply paste to individual pads by syringe was waste of time.
> It was much easier to:
>
> 1) tin all pads using a soldering iron and 0.5mm solder wire.
>
> 2) use tweezers to lay all components on the board in approximate location.
>
> 3) apply liquid rosin flux over the whole PCB.
>
> 4) use two soldering irons to simultaneously maneuver the component and
> melt solder of each pad.
>
>
> For desoldering large ICs I use a cheap electric hot plate from a
> kitchen shop. I place layer of glass cloth followed by the PCB. I get
> the PCB to 100 ~ 150C and then hot air gun on top to desolder the IC in
> question. Lifts off in a breeze, without any collateral damage.
> Double sided heating like this is much less heat stress.
>