Yes that's exactly true Markus. Although this particular PCB was single
sided and was pre drilled only because of convention.
I only tried hot roll lamination once and having discovered the problems
of handling this film I looked at using wet lamination. I discovered
this method was possible and so I investigated and experimented. The
thing I like about it is the utilisation of water to wash away
particles. Its also difficult peeling away the film and not letting the
photoresist touch itself, because when it does you can't release it and
it useless.
You obviously had spent the time and achieved much more success and than
me with hot lamination. I'd be interested in seeing photos.
Is your typewriter paper on the copper side of the PCB before it goes
into the laminator ? I envisioned you used the paper to temporarily
separate the dry film photoresist and the copper surface prior to hot
roll lamination. Once the start of the PCB and photoresist film have
entered the rollers the paper was dragged out at same rate as the
rollers thus leaving a small distance where the photoresist and copper
are in close contact, but not long enough to take adhesion.
Adam
Markus Zingg wrote:
> I could be wrong, but the way his board looks, and from what I know from
> Adams past postings to this group, it seems to be through plated. There
> you obviousely must drill bevor you plate and then expose, developp,
> etch etc etc.
>
> Markus
>
> DJ Delorie schrieb:
>>
>> Thanks for the tutorial! I noticed your board is pre-drilled... do
>> you always drill first? Any tips there? I usually used the etched
>> dimple as a drill guide.
>>
>>
>
>