Works fine.
For some very fine pitch components it is even recommended to go
without mask between pins.
The only difficulty is traces between pads, you may get shorts between
them and pins sometimes which you have to clear manually after reflow.
But most of the time even that works without problem.
Another thing to watch out for is component self-alignment. When the
solder is molten the component "swims" on it aligning itself to the
position with lowest surface tension (usually centered). If you attach
traces or ground planes in unlucky spots the position with lowest
surface tension might be shifted misaligning your component. This can
however be avoided easily by connecting traces to the ends of pads
rather than the sides.
ST
On Nov 12, 2007 8:55 AM, art_lammoglia <art_lammoglia@...> wrote:
> Hello group.
>
> I was wondering if anyone here has attempted home reflow
> (toaster/hotplate) soldering of a fine pitch device on a non-
> soldermasked board? All comments appreciated.
>
> regards,
> Art
>
>
>
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