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Subject: Through hole plating question - Blackhole system

From: "dpersuhn" <dpersuhn@...>
Date: 2007-09-12

Hi folks,

I'm a hobbyist circuit designer, but have come up against a few boards
lately that are requiring a significant number of vias to route
properly while maintinging optimal component placement. Normally, I
would have just used a mechanical pth, but it's getting to be an
increasing pain to do so. I read Adam's paper on the blackhole method
and it leaves me with a few questions that I was hoping someone here
could answer.

I'm assuming that the entire process that Adam has posted is an
activation that would be followed by a galvanic copper plating
process. Am I correct in this assumption? If so, what exactly is
microetching? a quick etch to prep the copper surface for plating
adhesion?

I'm interested in setting up a plating station that would use this
method, but want to make sure that I fully understand how it works
before I start down that path.

Thanks,
Dave