tin-ELECTROplated-mask is suitable (only) for ammonium-persulfate-etching.
(NH4)2S2O8
DJ Delorie <
dj@...> wrote:
More random thoughts...
I was thinking about plated-through holes and how big fabs do them.
You drill, plate the holes, ∗then∗ etch. They use a tin electroplate
as the mask. Can we do something similar?
The idea:
Drill and electroplate the pcb.
Use a standard photomask, but in negative - expose where you want
copper to stay. Develop. Not sure if TT would stand up to the tin
plating.
Immerse in "Liquid Tin" to tin-plate the copper that's going to
remain.
Strip the mask and etch the board.
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