Neil, you are 100% right. If the solder is wicking to the other side, you do
not have a problem with resistance from the process used for plating. The
solder and the component lead are your conductor at this point. I also read
that article and thought it was very opinionated for some reason.
-Mike
----- Original Message -----
From: "Neil" <cobra_neil@...>
To: <Homebrew_PCBs@yahoogroups.com>
Sent: Saturday, May 10, 2003 11:34 AM
Subject: Re: SPAM: Re: [Homebrew_PCBs] Metalized holes
> I have to laugh! They start of by saying "Please consider the following
as an
> open minded statement that...",
> then later state "...isolation milling is a slow, expensive, almost 30
years
> old attempt to be different by someone who had a paranoia against chemical
> etching".
>
> Whether true or false, it's opinionated and obviously written in a tone
that
> screams desperation to not lose support for their products/methods. They
> also state things, but don't explain why.
>
> Yes, they're comparing PCB milling machines here and not specifically
> thru-hole activation, but I think that machines like LPKF would be great
for
> other uses -- like they can engrave front panels for electronic projects,
> etc.
>
> As for thru-hole plating, whenever I solder a component lead in a plated
hole,
> the solder always wicks itself thru the hole and over to the other side.
For
> flexible wires, I purposely add more solder so it builds up on the
opposite
> side, so I get a better mechanical hold. My guess is that even if there
is
> resistance with the "conductive paste" method, the solder will fill the
gaps
> and conduct properly. Of course, this is my thought/guess, as I've never
> done this before.
>
> I'm going to ignore that whole article as ∗desperate∗ marketing hype.
>
> -Neil.
>
>
>
> On Saturday 10 May 2003 11:53, Stefan Trethan scribbled:
> > hmm the guys from bungard don't like this.
> > they say it has too high resistance.
> >
> > http://www.bungard.com/downloads/ANTI_E.PDF
> > somewhere in there...
> >
> > regards
> > st
> >
> > 10.05.2003 18:30:02, Neil <cobra_neil@...> wrote:
> > >Here's one system/source for chemical thru-hole plating that I've had
> > > laying around in my bookmarks....
> > > http://www.thinktink.com/stack/volumes/volvi/condink.htm
> > >
> > >(I've never experimented with this though).
> > >
> > >Cheers,
> > >-Neil.
> > >
> > >On Friday 09 May 2003 19:29, JanRwl@... scribbled:
> > >> Markus!
> > >>
> > >> Please let us know what those "right chemicals" are, and how to apply
> > >> them! (Temperature? catalysts? time in bath? USW!)
> > >>
> > >> Then, what current (Strom, Amperes) per 0.1 m^2 to plate-through!
> > >>
> > >> But remember! The plating-through is done BEFORE etching!
> > >>
> > >> Thanks! Jan Rowland
> > >
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