On Sun, 03 Sep 2006 17:42:40 +0200, Leon Heller
<
leon.heller@...> wrote:
>
> He wants to know if you could solder one of those little parts with hot
> air
> that is situated near other ones. Presumably he is concerned about the
> hot
> air on the chip being soldered desoldering those near it.
> Leon
So what - they'll just solidify again.
It depends on what nozzle you use.
With the oven you can do an entire board.
With the hot air gun without nozzle you can also do entire boards by
moving it about.
With a 1cm nozzle you can nicely do individual ICs, but surrounding ICs
will be affected, i'd guess maybe a 3cm diameter circle that could
potentially melt.
With the tiny hot air pencil on the soldering iron i can take out or
solder individual 2-pin chips without the others around melting, or very
small ics if i move about over all the leads in a periodic fashion.
It's not really been much of a worry for me with surrounding components.
But then i don't put anything sensitive where it would be a problem on my
boards. I've definitely desoldered more chip components accidentally when
trying to butcher around with the soldering iron.
People sometimes have the misconception that things will fly away in the
airstream. That is not happening if the the volume/speed is low enough. I
sometimes do that with the hot air pencil though, blast components off
boards, that's good fun and lets you know when they are loose. ;-)
ST