I thought of that, but I've been able to get SOIC parts so far so I haven't
been forced into that corner yet.
If I was to use that technique and needed vias, I'd bend all leads except
whichever lead on the IC that was shared by both sides. If I'm going to
pass something though the board, it might as well be a lead on the IC. It's
easy to solder the top and bottom of DIP leads.
Robert
:)
-----Message d'origine-----
De :
Homebrew_PCBs@yahoogroups.com [mailto:
Homebrew_PCBs@yahoogroups.com] De
la part de Herbert E. Plett
Envoyé : avril 13 2006 22:15
À :
Homebrew_PCBs@yahoogroups.comObjet : Re: [Homebrew_PCBs] Surface mount VS Through-hole comparison
I bend the DIP's pins outward with a flat plier. Now these 'old fashioned'
chips become SMD.
...
As these chips are not exactly flush with the board (well, they could be)
there is some place for 'wired' vias under them. If you are careful and
patient enough, very narrow pads will allow you to pass two signals between
pads. Hard to align and solder, but possible.