Thanks (to both Derek & Leon) - makes alot of sense.
> > What would the changes be in the "modify them accordingly" step?
> 1. Lengthen the solder area as Leon indicated;
>
> 2. Shorten the width to just over .5 mm
>
> 3. Shorten the pad area beneath the chip so that the contact area on
> each side of the chip ends where the pad ends under the chip. In
> other words, for 0402, only about .5 X .2 mm (W X L1 or L2) of the
> pad is under each side of the chip.
--
Dave Hylands
Vancouver, BC, Canada
http://www.DaveHylands.com/