In a message dated 12/11/2002 12:01:08 AM Central Standard Time,
twb8899@... writes:
> Let me clarify the plating issue. Everything past the activator stage
> is "electrolytic". In the acid copper plating tank it takes about 30
> minutes to plate .001" of copper at 25 to 30 amps per square foot.
>
Gotcha! Thanks for clarification. I HAD originally realized he "activation"
was electroless, so it was easy to read confusion into all that.
Yeah, it'd take some TIME to electroless plate even only 0.001" of Cu, now,
wouldn't it! AND, I suspect that wouldn't even be very "nice", if it'd work
at all!
I wonder how the "solder plating" can look as thick as if it had been
"dipped", if it is only 3 tenths thick as you say??? Hmmm...
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