On Sat, 12 Nov 2005 11:20:03 +0100, Mike Young <
mikewhy@...>
wrote:
> Many of the traces for through hole parts end up on the top layer.
> Without
>
> hole plating, there doesn't seem enough capillary action to draw solder
> from
>
> the bottom pad to the top. Some of the leads will be unreachable, or at
>
> least inconvenient to get to. A small dab of solder paste on top might do
>
> it. Does the lead move enough heat to reflow the paste? Golly, but this
>
> seems more complicated than it needs to be.
>
>
> Also, the pads don't seem to take solder very well. I cleaned the board
> with
>
> the Goof-Off that Pulsar included with the kit. It has a slightly oily
>
> feel... Is this the problem? Will Tinnit improve matters?
>
>
> Mike.
>
I think the lead would heat through and reflow the paste on top, but i
would not do that.
You simply need to avoid top pads where there is bad access. If there is
just no other way use a piece of stranded wire, and solder on top without
closing the hole. Put it in the hole parallel to the component leg and
solder bottom.
ST