On Wed, 17 Aug 2005 19:54:00 +0200, Roy J. Tellason
<
rtellason@...> wrote:
>
> I was of the impression from earlier posts in this thread that the stuff
> you
> were talking about was lead-free, which is something I'd rather avoid if
> possible. Acidic flux strikes me as something else to avoid, as well.
I don't think it is a problem for tinning the board. There seem to be many
electroless and electroplating "tinning" methods that are tin-only too.
Remember if you solder with lead solder it will mix and be "almost" normal
percentage at the joints. Also, you have a rather large "waste" with the
tin that is washed off where there is no copper, so it is good there is no
lead in that.
Acid flux will not be a problem for tinning the board, as it can be
washed, but when trying to use that paste for SMD this is an issue. I'd
like to look into that 'cause it is vastly cheaper than SMD paste. I don't
stencil so even a slightly different paste might work all the same...
ST