MOTM

At 9:37 PM -0600 2002/04/26, Adam Schabtach wrote:
>Should I be sensible and use a heat
>sink when I'm soldering some of the more unusual parts in the 300s? Or is
>this being overcautious?

I don't believe a heat sink is necessary, otherwise Paul S would have 
indicated so. I haven't used a heat sink on any of my MOTM modules 
and have not had any problems with semis being burned. When soldering 
semis I try not to touch the soldering iron directly to the semi's 
pin. I try to heat the pad with the soldering iron, then apply the 
solder to the pad. When the solder melts it nicely wraps around the 
pin on the semi. All of this happens very quickly, in about 1 second, 
so the semi does not get too hot.