Fotoboard2 / step wedge issues - am I doing something wrong?
2010-03-22 by Philip Pemberton
Hi guys, Here's a step wedge from my latest attempt to make Fotoboard2 work properly: http://img413.imageshack.us/img413/8161/xyzvm.jpg Exposure time was 340 seconds for Step 1; step 2 is 1.414x less (divide time by 1.414), step 2 is another 1.414x less, and so on. Layering was as follows: Base: PCB L1: OHP transparency, inkjet printed, printed side flat on PCB L2: Stouffer 21-step exposure wedge What I'm getting is severe pitting of the photoresist layer, which is causing the photoresist to be breached during etching. My ground planes look like they've been applied with a sponge... I've aimed for a Step Held of 8, which worked fine for other photoresist laminates (Microtrak and CIF), but doesn't seem to work on Fotoboard2. I've also noted that the coating quality on FB2 seems to be somewhat poorer than MT -- for a start, the coating seems to "blob" and "bubble" towards the edge of the PCB, and in a few cases I've had boards where patches and strips in the middle have been had photoresist missing. Most odd. Although maybe this is down to the coating method used (FB2 is roller-coated; MT is dip-coated). So onto my questions: 1) Am I doing something wrong here? Should my "step held" be lower for this laminate? The image (link above) suggests a step reduction of around 3 or 4 (i.e. reduce time from 340secs to 120 or 85 seconds) might be more suitable, but this seems a bit low based on my experiences with other photoresists. 2) What would be a typical exposure time for FB2? Mega seem to shy away from making any recommendations, simply stating in the datasheet that "exposure times will depend on the UV unit and artwork in use". 3) For those who are using Fotoboard2, what process parameters are you using? Exposure time, developer type, that sort of thing would be useful. Thanks, -- Phil. ygroups@... http://www.philpem.me.uk/