I will not be gluing PCBs together to make them double sided. I do UHF level PCB design and the inter layer capacitance and properties (permittivity) of the PCB must be consistent and known in order to establish distributed capacitance and inductance filter stubs when designing boards with low VSWR properties.
If you're under 100Mhz or so on the PCB and using lumped capacitance and inductance design, you can probably get away with that type of multilayer hack.
The precision laminator approach is the only one that can accomplish this for me at the signal speeds I use.
Besides, after you print a fill on the direct to copper laser print. Don't u still have to foil it to prevent pitting with a laminator?
If you're under 100Mhz or so on the PCB and using lumped capacitance and inductance design, you can probably get away with that type of multilayer hack.
The precision laminator approach is the only one that can accomplish this for me at the signal speeds I use.
Besides, after you print a fill on the direct to copper laser print. Don't u still have to foil it to prevent pitting with a laminator?