In article <40B5325EDFC7D64F83DC128117C0AD2325AD55@...>, Jim Barnes <jim@...> wrote: > Could it be that the Liquid Tin-coated pad is less solderable than bare > copper? I found it didn't seem to tin easily for some reason but it does seem to depend on the quality of the rinsing after plating. Flux may be the key though, I have a spray can of re-flow solder flux which I spray onto freshly etched boards. -- Stuart http://www.torrens.org.uk/ZFC/gallery/winsor.html
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Re: [Homebrew_PCBs] Solderability and Etching
2010-02-24 by lists