Homebrew PCBs

"leon Heller" <leon355@...> writes:
> But it's just a single stage, not several stages as was claimed.

Are we reading the same page?  They don't describe their plating
process at all on that page, just that they plate the vias before
filling, then plate over them afterwards.  I would assume that the
plating processes are the same regardless of whether you're going to
fill the hole or not.