Chris, I don't think that you can much optimize your process by changeing the etchant. You easily can optimize the etching process itself though. You may want to optimize some other steps in your process too: a) exposure. Use an exposure unit (self built if you want, there are plenty of projects/plans around) That way you expose the stuff in as few as 10 seconds. The key factor here is the light source which should be ultra violet. b) The resist you use seems quite odd to me (requiereing wet application). There is dry film resist out there which should do much better. Simply laminate that one onto the brass. Should be a matter of ~3 minutes and not fuzzing around with water etc. c) Build a bubble etcher with a heater element in int. That way I'm sure you bring down your etching times significantly. You CAN use alternative etchants (and others here surely will give you replies), but be warned that the alternatives are much more agressive to the envireonement or cost significantly more because you can only use the mixture for one (or very few) etch process(es). The nice thing about Fe3Cl is that it lasts very very long when compared to the alternatives and it's dirt cheap, and is also less dangerous. Other etchants are extremly agressive to all your metal stuff surrouding the area where you etch. I mean it, you would not be the first one using this stuff just to find out that all of a sudden a lot of things around you get an instant rust layer.... Natriumpersulfat on the other hand is compareably expensive and does not last very long. Just my 2\ufffd Markus
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Re: [Homebrew_PCBs] New here and a question.
2007-11-05 by Markus Zingg
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