[sdiy] Thermal contact of exponential convertor components

[René Schmitz]

Hi Ryan,

allenre at umich.edu wrote:
> I'm gathering parts for the Rene Schmitz's VCO3, and I am wondering if I need to
> use heat sink compound on the transistor array and tempcos, or if I can epoxy
> them together.  I'm not sure of the method of applying the heat sink compound. 
> The ASM-1 page mentions that "The transistor ans the tempco resistors (if used)
> should be gooped up with heatsink compound... and tie-wrapped together, for
> best thermal result."  So, should I cover the components with the compound,
> then use a plastic tie-wrap to hold them close?  My understanding is that the
> heat sink compound helps to transfer heat, so I only need to apply it between
> the two components (in this case, a tempco and a 2SC1583), and the tie-wrap
> holds them together (since the compound is non-adhesive).  Is this correct? 

Exactly.

Personally I often use epoxy glue to couple these components. (Heat goo 
isn't that good a heat conductor anyway, its just better than an air 
bubble between the components. Thats why it needs to be applied very 
thin..) And finally wrap the assembly with a piece of heat shrink tube, 
to shield it somewhat against air drafts and radiated heat.

Cheers,
  René

-- 
uzs159 at uni-bonn.de
http://www.uni-bonn.de/~uzs159