[sdiy] Thermal contact of exponential convertor components

[allenre at umich.edu]

I'm gathering parts for the Rene Schmitz's VCO3, and I am wondering if I need to
use heat sink compound on the transistor array and tempcos, or if I can epoxy
them together.  I'm not sure of the method of applying the heat sink compound. 
The ASM-1 page mentions that "The transistor ans the tempco resistors (if used)
should be gooped up with heatsink compound... and tie-wrapped together, for
best thermal result."  So, should I cover the components with the compound,
then use a plastic tie-wrap to hold them close?  My understanding is that the
heat sink compound helps to transfer heat, so I only need to apply it between
the two components (in this case, a tempco and a 2SC1583), and the tie-wrap
holds them together (since the compound is non-adhesive).  Is this correct? 
Thanks,

Ryan Allen