[sdiy] Thermal contact of exponential convertor components

[Ray Wilson]

Hi Ryan

I have had success sandwiching components together with heat sink compound
and shrink tubing. Obviously you want to go easy on the heat so you don't
damage or change the value of any component. Its working for me holding my
PT146s to my LM394s. And by not using epoxy you can take it apart to replace
a bad component without breaking everything.

Ray

----- Original Message ----- 
From: <allenre at umich.edu>
To: <synth-diy at dropmix.xs4all.nl>
Sent: Sunday, May 16, 2004 11:43 AM
Subject: [sdiy] Thermal contact of exponential convertor components


> I'm gathering parts for the Rene Schmitz's VCO3, and I am wondering if I
need to
> use heat sink compound on the transistor array and tempcos, or if I can
epoxy
> them together.  I'm not sure of the method of applying the heat sink
compound.
> The ASM-1 page mentions that "The transistor ans the tempco resistors (if
used)
> should be gooped up with heatsink compound... and tie-wrapped together,
for
> best thermal result."  So, should I cover the components with the
compound,
> then use a plastic tie-wrap to hold them close?  My understanding is that
the
> heat sink compound helps to transfer heat, so I only need to apply it
between
> the two components (in this case, a tempco and a 2SC1583), and the
tie-wrap
> holds them together (since the compound is non-adhesive).  Is this
correct?
> Thanks,
>
> Ryan Allen