Lpc2000

> The solder vaporphase reflow/IR reflow may explain our problem to obtain
> chips in quantities of 10. The chip will aquire the temperature of the
> solder. Presence of moisture inside the package could cause cracking of
> housing. So they get shipped in dry packs containing 250 chips. The
> distributor is paralyzed into no action fearing to break the drypack!
> This is a hypothesis of course, anybody has one better?

Expecially if they're using Pb free leads and the newer plastics that are
used with them--several manufacturers that I know of are having moisture
uptake/retention problems and are recommending a 'prebake' period to lower
the moisture of the chips.

Heat oven to 210F, insert chips, bake until a light golden brown.....

Cheers,
David