laminator, vacuum, 5-mil spirals - report
2009-03-26 by DJ Delorie
Today was the first chance I've had to try out the new laminator and vacuum stuff. I printed a 5-mil spiral pattern for testing. Laminator: it comes up to temp pretty quickly (<1min) but I let it warm up for 30 minutes to make sure the insides of the rollers were warm too. At 240F it was running 4 sec on, 27 sec off - I think it has plenty of range beyond the 320F it was factory-configured for. This is a GBC 9" with my digital temperature control. The film stuck after lamination. Even now I can't scratch it off with my fingernail. However, it didn't solve the problems of air bubbles. I still need to practice getting the film onto the pcb without bubbles; a better lamination won't help otherwise. I tried exposing the bubbles anyway to see if they'd re-laminate after developing, but the film that was bubbled was also distorted by the heat - apparently it needs the thermal mass and/or smooth surface of the pcb else it gets all wrinkly and won't take an exposure properly. One option is to put paper (or better, something lint-free) between the film and pcb, and hold it back as the laminator feeds so that the film and pcb come together right at the rollers. The vacuum system worked like a charm, though. Wherever the lamination was good, the traces were good, with only a 1 mil variation (due to the printer's precision; I've posted about this before). I think I need to cut down my exposure some, though, as I'm getting more bridging than breaking. Time to re-calibrate. I've seen sites say to use a shorter exposure for finer lines, too. Microscope photos here, all 200x: http://www.delorie.com/pcb/djspirals/ I made the mistake of re-laminating afterwards with paper over the pcb to keep it from sticking to the rollers. It stuck to the paper. I was able to peel the paper off without damaging the film too much, but next time I'm saving the poly film that I peel off ;-) I tried wet-laminating the second pcb but it appears to also have bubbles in it. I might need to do the old squeegie method with the heat gun, and laminate afterwards just to ensure adhesion. I did think about using a vacuum to do the lamination. I came up with this plan: top plate air gap flexible vacuum film - mylar, poly, whatever UV film - stuck to vacuum film (static?) air gap PCB goes here Lower plate - heating plate, smooth top. What you do is vacuum both air gaps to as near perfect as you can get, then release the vacuum in the top gap - the mylar will press the film against the pcb, with no air bubbles because there's no air. The pressure holds the film flat against the PCB. Now heat up the lower plate to 240F to laminate it. Cool, release vacuum. Perfect lamination?