On Sun, 29 May 2005 17:48:48 +0200, Robert Hedan <robert.hedan@...> wrote: > Ok, so we want to make sure the temperature is spread evenly. > What if we change approach? Instead of putting the heat onto the > transfer, > why not put the transfer within the heat? > Take 2 metals plates, clamp the PCB and transfer paper between both, and > slip the assembly into a convection oven at the desired temperature for X > minutes? > Robert > > I think someone has tried it, look in the archives. you need pressure, and heat, both in the right amount and right places, and right timing. I'm not saying a press won't work or a oven won't work, what i'm saying is i can guarantee that a fuser or laminator will work very well. Of course you are encouraged to experiment, only this way we learn of new methods. ST
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Re: RE : [Homebrew_PCBs] New paper for TT! Reynolds Parchment Paper
2005-05-29 by Stefan Trethan