Exerpt from an article in Electronic Design - maybe the epoxy is available without the other paraphanelia. I haven't looked into it - just got the e-mail article this morning. (the foil mentioned appears to be just a mask to keep the epoxy restricted to the desired holes). For the complete article: www.elecdesign.com/Articles/Index.cfm?AD=1&ArticleID=9984 Norm PLATED THROUGH HOLES The ProConduct system is designed to create plated through holes without resorting to electroplating. The approach starts by applying an adhesive foil to both sides of a board and then drilling the holes that will be plated /(Fig. 4 <http://www.elecdesign.com/Articles/9984/Figure_04.gif>)/. Application of a conductive epoxy paste follows in a method of placing the board on a vacuum table, applying the paste, and pressing it through the holes /(Fig. 5 <http://www.elecdesign.com/Articles/9984/Figure_05.jpg>)/. This occurs for both sides of the board. After that, the foil on both sides is removed /(Fig. 6 <http://www.elecdesign.com/Articles/9984/Figure_06.jpg>). / Next, the board is placed in an oven for about half an hour /(Fig. 7 <http://www.elecdesign.com/Articles/9984/Figure_07.jpg>)/. At this point, the board can be populated. The conductivity of hole plating is nearly as good as the electroplated approach, and ProConduct is significantly cleaner and easier to use. Typical resistance is 20 to 60 m(omega). The minimum size hole is 0.3 mm. Plated through holes for multilayer boards are done in the same fashion as double-layer boards. However, the layers are stacked before the adhesive foil is applied. LPKF Laser and Electronics /*www.lpkfusa.com*/ -- No virus found in this outgoing message. Checked by AVG Anti-Virus. Version: 7.0.308 / Virus Database: 266.9.1 - Release Date: 4/1/2005
Message
Plated thru holes
2005-04-06 by Norm Stewart
Attachments
- No local attachments were found for this message.